New copper plating bath chemisties are being developed to meet the emerging need of plating copper into submicron features on semiconductor wafers. These chemistries are designed to provide a fast, efficient, fill for even the most challenging wafer terrain. It has been found that maintaining the concentration of the additives in these plating baths at certain levels is critical to the performa...

he 23 US. Army installations engaged in plating employ a variety of techniques to treat wastewater. While some sites have implemented recovery and T reuse, a majority still find it advantageous to precipitate the metals and discharge the wastewater. Sludge is collected in clarifiers, treated by gravity thickening, then dewatered in pressure or vacuum filters, lagoons or drying beds. The dewater...

The elimination of compounds such as lead (Pb) and cadmium (Cd) from electrical and electronic equipment as a result of the Restriction of Hazardous Substances (RoHS) annex of the European Union’s Waste from Electrical and Electronic Equipment (WEEE) Directive 2002/95/EC is rapidly approaching the deadline of July 1, 2006. While the RoHS annex to the WEEE directive specifically refers to restri...

In the last years efforts were made to overcome the widespread screen printing metallization technique to reduce shading of the front side, increase the finger conductivity, and improve the contact properties of the metallization of crystalline silicon solar cells. A promising approach is plating via wet chemical metal deposition. Hereby, the metals nickel as contact layer and copper or silver ...

Owing to its low cost and high natural abundance, sodium metal is among the most promising anode materials for energy storage technologies beyond lithium ion batteries. However, room-temperature sodium metal anodes suffer from poor reversibility during long-term plating and stripping, mainly due to formation of nonuniform solid electrolyte interphase as well as dendritic growth of sodium metal....

ajor emphasis is placed today on treating plating solutions and rinsewater to reduce the concentration of toxic metals to below established limits prior to discharge or water reuse. Available technology is adequate for partial treatment of most wastewater; however, new technology is needed to scavenge heavy metals from complexed or chelated compounds in rinsewater. Several report^^-'^ from this...

background: this paper describes the common hazards in the metal industry – chemicals and noise. the aim of the study was to get an overview of risk levels of mentioned occupational hazards and examine the implementation of adequate safety measures. methods: measurements of noise and chemicals were performed, self-reported exposure and usage of personal protective equipment from workers were us...

A need t o find a suitable replacement for cadmium electroplated coatings on mediumto highstrength steels has accelerated the development of economically viable alternatives. This edited version of a presentation at the 30th annual AerospaceIAirline Plating & Metal Finishing Forum examines the development of Australia's Defence Science and Technology Organisation's (DSTO) zinc-nickel electropla...