Thermomechanical analysis of monolithic microwave integrated circuit (MMIC) packaging is essential to guarantee the reliability radio frequency/microwave applications. However, a method for fast and accurate MMIC structures has not been developed. Here, machine learning (ML)-based solution thermomechanical demonstrated. This ML-based analyzes temperature thermal stresses considering key design ...

—This paper presents the design of a highly linear broadband power amplifier (PA) operating from 200MHz to 3GHz for Long Term Evolution (LTE) pico-cell base station. The monolithic microwave integrated circuit (MMIC) PA is realized with 0.25-μm Enhancement Mode Pseudomorphic High Electron Mobility Transistor (E-pHEMT) process. The broadband PA employs a novel dual feedback technique to achieve...

Development of Millimeter Wave Integrated-Circuit Interferometric Sensors for Industrial Sensing Applications. (December 2004) Seoktae Kim, B.S., Inha University, S. Korea; M.S., Pohang University of Science and Technology, S. Korea Chair of Advisory Committee: Dr. Cam Nguyen New millimeter wave interferometric, multifunctional sensors have been studied for industrial sensing applications: disp...

Abstract The concept, state of the art, and future development directions of hybrid semiconductor integrated circuits (HySICs), which combine RF-CMOS ICs with compound semiconductor monolithic microwave integrated circuits (MMICs) are described in this paper, taking up recent wireless technologies as example applications. It is shown that ICs with superior function can be designed by mixing the...

This paper presents a broad-band spatial powercombining system based on tapered-slot antenna arrays integrated in a standard WR-90 waveguide environment. The system is designed using a modular tray architecture, providing full waveguide-band frequency coverage and an excellent thermal environment for a set of monolithic-microwave integrated-circuit (MMIC) amplifiers. The shape of the tapered-sl...

A highly integrated Ka band front-end receiver is presented. The proposed front-end receiver is developed for a Ka band passive imaging system. The design adopts single-stage heterodyne architecture at 2 GHz intermediate frequency (IF). Further, a two-layer planar technology is adopted for compact realization. The top layer of the front-end comprises of two monolithic microwave integrated circu...

Abstract This paper discusses the design steps and experimental characterization of a monolithic microwave integrated circuit (MMIC) power amplifier developed for next generation K-band 17.3–20.2 GHz very high throughput satellites. The technology used is commercially available 100-nm gate length gallium nitride on silicon process. chip was taking into account demanding constraints spacecraft a...

A Ka-band monolithic low-noise amplifier (LNA) with high gain and dynamic range (DR) has been designed implemented in a 100-nm gallium nitride (GaN)-on-Si technology. The LNA is as the first stage of DR receiver an frequency modulated continuous wave (FMCW) radar for detection small drones. three-stage microwave integrated circuit (MMIC) linear 26 dB noise figure (NF) 2 band 33-38 GHz. output 1...