Non-conductive film with Zn nano-particles (Zn-NCF) is an effective solution for fine-pitch Cu-pillar/Sn– Ag bump interconnection in terms of manufacturing process and interfacial reliability. In this study, NCFs with Zn nano-particles of different acidity, viscosity, and curing speed were formulated and diffused Zn contents in the Cu pillar/Sn–Ag bumps were measured after 3D TSV chip-stack bon...

3 Ordered Cu-(35–50) at.% Pd alloys (B2-type superstructure) have a high corrosion resistance and are distinguished by possessing very low electrical resistivity r » (4–8) × 10 ohm m (1), two properties which make them of interest to researchers developing functional materials. However, wide-scale use of these alloys is hindered by their relatively poor strength properties: the yield stress of ...

a r t i c l e i n f o The influence of adsorbed S on surface segregation in Cu x Pd 1 − x alloys (S/Cu x Pd 1 − x) was characterized over a wide range of bulk alloy compositions (x = 0.05 to 0.95) using high-throughput Composition Spread Alloy Film (CSAF) sample libraries. Top-surface and near-surface compositions of the CSAFs were measured as functions of bulk Cu composition, x, and temperatur...

We report evidence in several experiments for nanometer-size effects in surface chemistry. The evidence concerns bimetallic systems, monolayer films of Pt or Pd on W(111) surfaces. Pyramidal facets with [211] faces are formed on annealing on physical monolayer of Pt, Pd on a W(111) substrate, and facet sizes increase with annealing temperature. We used synchrotron radiation-based soft x-ray pho...

although cu and fe are immiscible under equilibrium conditions, they can form supersaturated solid solutions by mechanical alloying. in this paper, nano-structured of the metastable cu-fe phase containing 10, 15, 20 and 25% wt fe were synthesized by intensive ball milling for 15h, in order to achieve a solid solution of fe in cu. the phase composition, dissolution of the fe atoms into the cu ma...

a simple method has been developed for the preconcentration of copper(ii) based on the adsorption of its modified nano polyacrylonitrile fiber. modified nano polyacrylonitrile fiber (panf) was prepared by adding of acrylic fibers to msethanolamine (mma) with different concentration solutions. the stability of a chemically modified nano polyacrylonitrile fiber especially in concentrated hydrochl...

The interaction of ultrathin Cu films with Pd(111) was studied by X-ray photoelectron spectroscopy (XPS). The effects of Cu coverage and annealing temperature were investigated. The XPS data show that at room temperature Cu grows on Pd(111) layer-by-layer without alloying. Furthermore, Cu 2p3/2 core-level shifts as a function of film thickness indicate that the Cu-Pd interactions perturb the el...

This paper compares and discusses the wearout reliability and analysis of Gold (Au), Palladium (Pd) coated Cu and Pd-doped Cu wires used in fineline Ball Grid Array (BGA) package. Intermetallic compound (IMC) thickness measurement has been carried out to estimate the coefficient of diffusion (Do) under various aging conditions of different bonding wires. Wire pull and ball bond shear strengths ...

A novel welding technique of diffusion bonding for Zr-Cu metallic glass with pre-oxidized surfaces is proposed in this study, which systematically investigated by molecular dynamics (MD) simulation. Compared the conventional technique, process can be well implemented below crystallization temperature glass. The obtained structure possesses glass–glass interfaces (GGIs) similar those nano-glasse...

The analysis of (bio)available copper in complex environmental settings, including biological test media, is a challenging task. In this study, we demonstrated the potential of a recombinant Pseudomonas fluorescens-based biosensor for bioavailability analysis of CuSO4 and CuO nanoparticles (nano-CuO) in seventeen different ecotoxicological and microbiologial test media. In parallel, free Cu in ...