Abstract Physical vapor deposition (PVD) refers to the removal of atoms from a solid or liquid by physical means, followed those on nearby surface form thin film coating. Various approaches and techniques are applied release including thermal evaporation, electron beam ion-driven sputtering, laser ablation, cathodic arc-based emission. Some based plasma discharge, while in other cases composing...

Abstract Currently, scientists are striving to produce innovative textile materials characterized by special properties. Therefore, attempts have been made use physical and chemical vapor deposition techniques modify the surface of materials, i.e., nonwovens, fabrics, knitted fabrics. By using these for modifying basic researchers obtained textiles with novel properties, which used in shielding...

A growing body of experimental work indicates that physical vapor deposition provides an effective route for preparation of stable glasses, whose properties correspond in some cases to those expected for glasses that have been aged for thousands of years. In this work, model binary glasses are prepared in a process inspired by physical vapor deposition, in which particles are sequentially added...

Activation Energy is an important feature in determining the formation of ohmic contact on a semiconducting material. Activation energy depends on workfunction of the semiconductor. Thus, there is a good co-relation between the ohmicity, activation energy and workfunction. In this work, Cadmium Sulphide (CdS) thin film of 2 μm thickness is the semiconducting material fabricated using Chemical V...

In this work 1 , we study graphene growth dynamics on epitaxial Cu thin film substrates by chemical vapor deposition (CVD). These surfaces have a single crystallographic orientation and are atomically smooth, unlike their foil counterparts, making them better platforms on which to reproducibly synthesize highquality graphene and study crystal growth evolution. Consequently, we gained novel insi...

Low-pressure sputtering and ionized vapor deposition processes create atomic fluxes with kinetic energies in the 1.0–20 eV (and above) range. The impact energy of these hyperthermal atoms significantly effects the surface morphology and structure of vapor deposited films. Recent molecular dynamics simulations of metal atom interactions with a metal surface have established the energy and angula...

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