This document treats the crosstalk between parallel conductors. The conductors can represent either conductors in a multiconductor cable or traces on a printed circuit board (PCB). An analysis method based on a lumped circuit equivalent for the problem as well as a method to calculate the per unit length parameters are presented. The computed results are validated by comparison with measurement...

Recovery of gold and other valuable metals from electronic scrap involves a complex metallurgical flow sheet and requires state-of-the-art recovery technologies that are available in large-scale, integrated smelter and refinery operations. At the end of their use, electronic and other electrical product scrap offer an important recycling potential for the secondary supply of gold and silver...

This work aims to compare the implementation of two metamaterials for reducing electromagnetic interference (EMI) in printed circuit boards (PCBs). Specifically, complementary split-ring resonators (CSRRs) and electromagnetic bandgaps (EBGs) were etched on the ground plane of a microstrip transmission line. Both techniques were compared as EMI filters, taking into account frequency response, si...

On the Printed Circuit Boards (PCBs), the interconnection geometry influences the ElectroMagnetic Compatibility (EMC) and the Signal Integrity (SI). The impact increases when circuits with a non-linear behavior are connected at their terminations. An accurate EMC analysis requires an electromagnetic solver including the model of those non-linear components. The insertion is made via lumped elem...

In this study, we propose a segment substitution method (SSM) for the fast analysis of non-periodic electromagnetic bandgap power distribution network (NP-EBG PDN) in high-speed packages and printed circuit boards (PCBs). The proposed SSM is based on hybrid desegmentation segmentation methods, analytical equations an EBG structure that are derived herein. verified using full-wave simulations me...

This study deals with the issue of copper separation from acidic etching solutions formed during process production printed circuit boards (PCBs) for electrical and electronic industries. The article describes selected methods summarizes results an experiment, in which efficiency recovery depleted acid by cementation precipitation method was verified. In cementation, iron form metallic swarf us...

The thermally induced warpage of electronic substrates is a significant concern in manufacturing processes. The ability to evaluate substrate behavior with respect to temperature is particularly important to manufacturing engineers. Previous measurement of thermally induced warpage on Printed Circuit Boards (PCBs) using general Shadow Moiré cannot provide enough sensitivity for modern electroni...

This paper proposes an unsupervised method for material classification of raw printed circuit boards (PCBs) based on the dimension-reduced spectral information. First, a spectral imaging system is constructed for acquiring precise spectral reflectance images. Only 3-dimensional spectral features are then extracted from the original 31-dimensional spectral image data by PCA for segmentation prop...

Laser Direct Imaging (LDI) in the production of printed circuit boards (PCBs) offers a number of advantages over traditional contact printing methods. This paper reviews the basics of LDI technology and explores how solid state laser technology has positively impacted system throughput and cost-of-ownership characteristics. 1 LDI Basics In LDI, a laser is used to image a pattern directly on to ...

This paper aims to analyse the design techniques of differential transmission lines loaded with metamaterials. Specifically, complementary split-ring resonators (CSRRs) were etched on the ground plane of a microstrip transmission line in order to mitigate both differentialand common-mode propagation in differential signalling. Several prototypes were manufactured and characterised in printed ci...