introduction a large number of orthodontists prefer to rebond the failed bonded brackets or use recycled brackets in some instances. the aim of this study was to compare the shear bond strength of rebonding with using recycled brackets on enamel surface. methods bonding of brackets on the surface of extracted first bicuspids was tested in five different groups to compare their shear bond streng...

Abstract Objectives: This study aimed to compare the shear bond strength (SBS) related surface treatment methods of debonded brackets before indirect rebonding and evaluate changes in SBS sandblasting time. Methods: After were from a dental cast during an bonding procedure, seven groups assigned conduct tests. Sandblasted sprayed with Al 2 O 3 for s (Group II), 6 III), 9 IV), 12 V). In Group VI...

Functionalization of metal–organic frameworks (MOFs) is critical in exploring their structural and chemical diversity for numerous potential applications. Herein, we report multiple approaches the tandem postsynthetic modification (PSM) various MOFs derived from Zr(IV), Al(III), Zn(II). Our current work based on our efforts to develop a wide range MOF platforms with dynamic functional nature th...

The expansion of the application polymers instead metals has warranted evaluation and modeling their mechanical behaviors under various conditions. In present study, strain-rate- temperature-dependent nonlinear behavior a glassy polymer from small to large strain ranges is investigated experimentally numerically. effects rate temperature on responses development field monotonic cyclic uniaxial ...

Introduction: The biggest challenge that orthodontist face in the clinical practice is debonding of the brackets. The best way to avoid bond failure is to adhere strictly to the rules of good bonding. Aims and Objectives: Aims and objectives of the study were to measure shear bond strength of orthodontic brackets which were rebonded using different tooth surface reconditioning methods that are ...

The mechanical behavior of electrically conductive adhesive joints exposed to elevated temperature and relative humidity conditions has been investigated, and failure mechanisms of conductive adhesive joints have been determined. Three model, silver-filled, epoxy-based adhesive systems have been studied in conjunction with printed circuit board (PCB) substrates with metallizations of Au/Ni/Cu a...