An anisotropic conductive adhesive (ACA) bump was produced on a silicon chip for bonding onto a glass substrate. The bumping process and the bonding procedure are described. The constituents of the ACA were investigated with a scanning electron microscope (SEM) and energy dispersive spectroscopy (EDS). The thermal behavior of the ACA was investigated with differential scanning calorimetry (DSC)...

In this paper, a novel and simple one-port de-embedding technique has been applied to through-silicon-via (TSV) characterization and modeling. This method utilized pad, via, and line structures to extract the equivalent circuit model of TSV. The main advantage of this deembedding method is that it can reduce the chip area to fabricate test element groups (TEGs) for measurements while keeping S-...

The microelectronics industry has implemented a significant number of process technologies to accomplish the various packaging and backend operations. These technologies have been successfully implemented at a number of contract manufacturing companies and also licensed to many of the semiconductor manufacturers and foundries. The largest production volumes for these technologies are for silico...

This paper develops analytically a statistical model for predicting the material removal in mechanical polishing of material surfaces (MS). The model was based on the statistical theory and the abrasive–MS contact mechanisms. The pad-MS and pad-abrasive-MS interactions in polishing were characterised by contact mechanics. Two types of active abrasive particles in the polishing system were consi...

The requirement for improved electrical performance and reduced silicon area has driven Copper to replace Aluminum interconnection as silicon technology is scaled beyond 0.25μm. The frontend change, in turn, pushes the wirebond pad pitch from above 100μm to the 80μm-66μm range. This creates challenges for back-end to probe and wire bond at fine pitch geometry onto a readily oxidized Copper surf...

An imaging Pixel Array Detector (PAD) is being developed to record x-ray scattering images from single particles at the SLAC Linac Coherent Light Source (LCLS) x-ray free electron laser. The LCLS will deliver x-ray pulses of 5 – 200 femtosecond duration 120 times per second. Proposed experiments require that the scatter from each pulse be independently recorded. This necessitates a detector wit...

Objective: Peripheral Arterial Disease (PAD) is a state characterized by atherosclerotic occlusive disease of lower extremities. Diabetes is the main risk factor for PAD. Material and Methods: To assess the prevalence of PAD, a cross sectional study was performed on 352 diabetic patients who referred to Yazd diabetes research center from 2007 to 2010. Vascular assessment was done by measuring ...