ABSTRACT A novel hydrogen activation technology based on activated or electron attachment (EA) has been developed for fluxless soldering at ambient pressure and normal temperature. The the potential to be used several applications in electronics packaging industry. Recent work from a joint effort between Air Products Sikama International alpha trials of production-scale furnace flux-free wafer ...

What automated soldering methods can be considered for Mini-Circuits surface-mount components? There are two basic methods: reflow and wave soldering. Generally, reflow soldering can be done when (l) there are only surface mount components, or (2) these are present together with through-hole components and the latter will be soldered in a separate (wave soldering) step. The surface-mount compon...

In the study, embedded BASIC Stamp 2 (BS2) microchip controller is used to design with Hopfield neural network (HNN) as the foundation of sample training, which applies for a soldering platform of mechanical vision and accomplishes PCB soldering positioning technology. The proposed system design method in this paper can be divided into two parts: 1) the control rules of RC servo motor is design...

Abstract Most fluxes and their flux residue are corrosive, presence on the surface of assemblies may cause reliability concerns due to electrochemical migration. This study firstly refers test method IPC-TM-650 2.3.32D 2.6.15C requirements in J-STD-004A evaluate flux-induced corrosion corrosivity residue. Then thermogravimetric analysis is used level after soldering under identical conditions. ...

The cleaning process in the surface mount assembly line of power modules had been found to insufficiently remove solder flux residue from printed circuit board (PCB) assemblies after the process of reflow soldering. This thesis details the development of an optimized cleaning process that effectively removes solder flux residue from PCB assemblies. The first stage of this study involves the exp...

The goal of the study is to compare quality of vapour phase reflowed solder joints soldered on different printed circuit board (PCB) surface finishes. Vapour phase reflow soldering guarantees the highest reliability, quality of processing and process safety. The big advantage of heat transfer in vapour phase soldering (VPS) is the extremely efficient transfer of latent heat through the condensi...

PURPOSE The present study was intended to evaluate the effect of soldering techniques with infrared ray and gas torch under different gap distances (0.3 mm and 0.5 mm) on the tensile strength and surface porosity formation in Ni-Cr base metal alloy. MATERIALS AND METHODS Thirty five dumbbell shaped Ni-Cr alloy specimens were prepared and assigned to 5 groups according to the soldering method ...

We start this work by revisiting the problem of the soldering of two chiral Schwinger models of opposite chiralities. We verify that, in contrast with what one can conclude from the soldering literature, the usual sum of these models is, in fact, gauge invariant and corresponds to a composite model, where the component models are the vector and axial Schwinger models. As a consequence, we reint...