The opportunity for substantial efficiency enhancements of thin film hydrogenated amorphous silicon (a-Si:H) solar photovoltaic (PV) cells using plasmonic absorbers requires ultra-thin transparent conducting oxide top electrodes with low resistivity and high transmittances in the visible range of the electromagnetic spectrum. Fabricating ultra-thin indium tin oxide (ITO) films (sub-50 nm) using...

Deep reactive ion etching (DRIE) of borosilicate glass and profile control of an etched groove are reported. DRIE was carried out using an anodically bonded silicon wafer as an etching mask. We controlled the groove profile, namely improving its sidewall angle, by removing excessively thick polymer film produced by carbonfluoride etching gases during DRIE. Two fabrication processes were experim...

 Thinning of micromachined wafers containing trenches and cavities to realize through-chip interconnects is presented. Successful thinning of wafers by lapping and polishing until the cavities previously etched by deep reactive ion etching are reached is demonstrated. The possible causes of damage to the etched structures are investigated. The trapping of particles in the cavities is studied a...

With the increasing interest in establishing directional etching methods capable of atomic scale resolution for fabricating highly scaled electronic devices, the need for development and characterization of atomic layer etching processes, or generally etch processes with atomic layer precision, is growing. In this work, a flux-controlled cyclic plasma process is used for etching of SiO2 and Si ...

The bombardment of a 26 nm poly(methyl methacrylate) (PMMA) film has been studied as a model for depth profiling of polymeric samples using a newly developed C60 þ ion source. Experiments were conducted on a ToF-SIMS instrument equipped with C60 þand Gaþ ion sources. A focused dc C60 þ ion beam was used to etch through the polymer sample at specified time intervals. Subsequent spectra were reco...