Low stacking fault energy face centered cubic (FCC) materials contain characteristic defect structures. Stacking fault tetrahedral are one of those rare structures that occur under special experimental conditions. For the first time, stacking fault tetrahedral were observed in Fe-30Mn-3Al-3Si twinning induced plasticity (TWIP) steel. Their presence resulted from a quenching heat treatment.

In this paper, architectures for low-noise high-speed image sensors based on 3D stacking technology are discussed. Effectiveness of the 3D-stacking technology for low-noise high-speed image sensors is demonstrated in an implementation of a 33Mpixel 240fps 3D-stacked CMOS image sensor based on 12b 3-stage cyclic-based pipelined ADCs. For extremely low noise and wide dynamic range imaging, highly...

We present an analysis of a general machine learning technique called ‘stacking’ for the estimation of photometric redshifts. Stacking techniques can feed the photometric redshift estimate, as output by a base algorithm, back into the same algorithm as an additional input feature in a subsequent learning round. We shown how all tested base algorithms benefit from at least one additional stackin...

Stability of the π-π stacking interactions in the Ben||N-substituted-coronene complexes was studied using the computational quantum chemistry methods (where Ben is benzene and || denotes π-π stacking interaction, and N-substituted-coronene is coronene molecule which substituted with different number of N atoms). The results reveal simultaneous effects of structure and number of Heteroatom on th...

We have developed moiré nanosphere lithography (M-NSL), which incorporates in-plane rotation between neighboring monolayers, to extend the patterning capability of conventional nanosphere lithography (NSL). NSL, which uses self-assembled layers of monodisperse micro/nanospheres as masks, is a low-cost, scalable nanofabrication technique and has been widely employed to fabricate various nanopart...

This study reports a new stacking method for assembling a 3-D microprobe array. To date, 3-D array structures have usually been assembled with vertical spacers, snap fasteners and a supporting platform. Such methods have achieved 3-D structures but suffer from complex assembly steps, vertical interconnection for 3-D signal transmission, low structure strength and large implantable opening. By a...

Design complexity is increasing day by day in modern digital systems. Due to reconfigurable architecture, low non recurring engineering (NRE) and ease of design field programmable gate arrays (FPGA) become a better solution for managing increasing design complexity. Due to scaling trends FPGA uses more transistors which increase the leakage current. FPGAs are well suited for wireless applicatio...