The influence of medium ingredients on extracellular dextransucrase production by a new bacterial strain Weissella confusa Cab3 (Genbank Accession Number JX649223) was evaluated using fractional factorial design of Taguchi’s orthogonal array. Four metabolism influencing factors viz. sucrose, yeast extract, K2HPO4 and Tween80 were selected to optimize dextransucrase production by W. confusa Cab3...

Purpose – To solve the trade-offs between marketing and R&D domains and to minimize information loss in new product development (NPD), this study proposes an integrated design process as a new solution to the interface system between the two domains. Design/methodology/approach – House of Quality integrated with multivariate statistical analysis is used for determining important design features...

Present work highlights application of utility theory combined with Principal Component Analysis (PCA) and Taguchi’s robust design for simultaneous optimization of correlated multiple surface quality characteristics of mild steel machined product prepared by straight turning operation. The study aims at evaluating the most favorable process environment followed by an optimal parametric combinat...

In this paper the effect of rotor geometry parameters on the d-axis and q-axis inductance of synchronous reluctance machines is investigated and an optimum design parameter combination is achieved to improve the saliency ratio as well as the performance of drive system. The 2D finite-element model of synchronous reluctance machine is used to construct the Taguchi design of experiments. The leve...

Purpose: This study aims to examine the interaction between process parameters and bead geometry, to perform the research to predict optimal bead geometry (bead width, reinforcement height, left leg length, right leg length) through the analysis of experimental data. For this, not only linear and the curvilinear equations were developed to predict bead geometry, but also interactions between pr...

Solder paste is the main soldering material used to form strong solder joints between printed circuit boards (PCB) and surface mount devices in the surface mount assembly (SMA). On average 60% of endof-line soldering defects can be attributed to inadequate performance of solder paste stencil printing. Recently, lead-free solder paste has been adopted by electronics manufacturers in compliance w...

Design of Experiment commonly referred to as DOE is one of the extensively used methods for experimental study of many processes in engineering. It is a statistical approach in which a mathematical model is developed through experimental runs. DOE provides us the opportunity to optimize and predict possible output based on the parameters setting. In this study, a review is done on DOE technique...