We present a thorough investigation of surface deformation and thermal properties of high-damage threshold large-area semiconductor saturable absorber mirrors (SESAMs) designed for kilowatt average power laser oscillators. We compare temperature rise, thermal lensing, and surface deformation of standard SESAM samples and substrate-removed SESAMs contacted using different techniques. We demonstr...

A novel concept of determining optimized cooling protocols for freezing three-dimensional organs has been developed and its feasibility examined computationally. The concept is based on determining correct spatial variation of temperature distribution on the walls of a freezing container at every instant of time during the cooling process so that local thermal stresses in the heterogeneous orga...

Thermo-mechanical behavior of the lead (Pb)-free ceramic copper column grid array (CuCGA) package under accelerated thermal cycling is characterized and compared with the conventional tin–lead (Sn–Pb) ceramic column grid array (CCGA). In situ thermal deformations of the highest DNP (distance to neutral point) copper column is measured for an initial isothermal loading of DT = 75 C and subsequen...

Thermal dilation is a vital component of deformation along the extensive railway network infrastructure. To monitor subtle deformation, Synthetic Aperture Radar Interferometry (InSAR) technique has been adopted as a space-borne geodetic tool. However, InSAR applications in railway stability surveillance have been largely limited by the sparseness of detectable point-like targets (PTs). Moreover...

Heating is inevitable in any bearing operation. This leads to not only the thinning of the lubricant but also could lead to a thermal deformation of the bearing. The present work is an attempt to analyze the influence of thermal deformation on the thermohydrodynamic lubrication of infinitely long tilted pad slider rough bearings. As a consequence of heating the slider is deformed and is assumed...

Thermal cycling is widely used as a qualification test in the microelectronic industry. This paper investigates an intriguing failure mode observed in such a test. Near the corners of a silicon die, shear stresses arise due to thermal expansion mismatch between the silicon and the packaging substrate. These shear stresses may have a small magnitude, being transmitted through packaging polymers,...

Flame bending process is one of the forming processes of steel plates. During this process, plate is formed with heating by gas torch flame followed by controlled cooling along specified paths. Considering simple tools used in the process, it is a popular and economical forming method. At present, this process is manually done on the basis of skilled technician’s &#10experience. Experimental an...

A fully-coupled thermoelastic model for a fixed pad thrust bearing has been developed. Pressure, film thickness and three-dimensional temperature profiles were obtained by simultaneously solving the Reynolds, film thickness, energy and force balance equations using a combined finite difference and finite element method. The elastic deformation due to the pressure and the thermal distortion due ...

Flame bending process is one of the forming processes of steel plates. During this process, plate is formed with heating by gas torch flame followed by controlled cooling along specified paths. Considering simple tools used in the process, it is a popular and economical forming method. At present, this process is manually done on the basis of skilled technician’s experience. Experimental and ...