Copper-Graphite laminate material design has been analysed, and this proposed composite has the ability to enhance heat dispersing more efficiently compared to the traditional high thermal conductivity with weight associated copper and high thermal resistance graphite. A finite element analysis (FEA) is carried out using the material (Cu – Gr) properties to investigate this proof. The design, t...

The thermal shock resistance of ceramics depends on not only the mechanical and thermal properties of materials, but also the external constraint and thermal condition. So, in order to study the actual situation in its service process, a temperature-dependent thermal shock resistance model for ultra-high temperature ceramics considering the effects of the thermal environment and external constr...

Owing to their high thermal conductivities, carbon nanotubes (CNTs) are promising for use in advanced thermal interface materials. While there has been much previous research on the properties of isolated CNTs, there are few thermal data for aligned films of single wall nanotubes. Furthermore, such data for nanotube films do not separate volume from interface thermal resistances. This paper use...

We use molecular dynamics simulation to investigate the early and developed stages of surface condensation. We find that the liquid-vapor and solid-liquid interfacial thermal resistances depend on the properties of solid and fluid, which are time-independent, while the condensate bulk thermal resistance depends on the condensate thickness, which is time-dependent. There exists intrinsic competi...

Abstract: Refractory materials containing cordierite (2MgO.2Al2O3.5SiO2) and mullite (3Al2O3.2SiO2) are used as support in furnaces, because of their low thermal expansion properties which confer them a very good ability to thermal shock resistance. Composed of two phases presenting very different CTE (1.5–3×10-6 for cordierite and 4–6×10-6 K-1 for mullite), these materials can develop damag...

Thermal resistance and air permeability of needle-punched nonwoven fabric made from jute and polypropylene blends have been studied using the Box and Behnken factorial design to observe the effect of fabric weight, needling density and blend proportion on thickness, thermal resistance, specific thermal resistance, air permeability and sectional air permeability. Correlation matrix and cluster a...

Replacing SiC substrates with the highest thermal conductivity material available, diamond (κ up to 2000 W/mK), will result in significantly lower thermal resistance AlGaN/GaN HEMTs. In this work we combine Raman thermography and thermal simulation to assess the thermal resistance of state-of-the-art GaN-ondiamond HEMTs. INTRODUCTION The RF output power density achievable for GaN-based high ele...

important aspect of computer design, with device performance being significantly affected by temperature. In addition, device lifetime can be decreased drastically because of large thermal stresses that occur especially at interfaces. The ability of a structure to remove heat is best quantified by its thermal resistance, which is given by the temperature difference divided by input power. In mi...

In this work, thermal transport in nanocrystalline materials is studied using large-scale equilibrium molecular dynamics simulation. Nanocrystalline materials with different grain sizes are studied to explore how and to what extent the size of nanograins affects the thermal conductivity and specific heat. Substantial thermal conductivity reduction is observed and the reduction is stronger for n...