ne of the corporate goals at AT&T is to eliminate chloroflurocarbons (CFCs) from its manufacturing operations by the end of 1994. Many alternatives have been implemented to meet this objective, including noclean wave soldering using low-solids flux, aqueous cleaning of water-soluble flux, aqueous cleaning with saponifiers and semiaqueous (terpene) cleaning. Part 1 of this article describes the ...

In this work we compare the microstructures of intermetallic compounds (IMCs) in electrochemically stripped solder joints created by two different soldering methods (vapor phase soldering (VPS), and selective laser soldering with a CO2 laser). After the selective removal of the Sn phase with amperometry, the microstructure and structural composition of the IMC can be revealed in a detailed way,...

 The RoHS and WEEE European Directive, recently introduced, [1,2], represent focal points for the environmental regulation in the field of electronics industry. While removal of some material of concern has been relatively straightforward, the reduction or quite elimination of Lead (Pb) has caused significant disruption to the electronics manufacturing supply chain [3]. This materials and tech...

For obtaining good joints by soldering, a wettability of liquid metal on the solid metal surface, relatlatte, relattlated o solderability, is one of the most important factors, and the wettability is accelerated by using a suitable flux and atmosphere. In atmosphere soldering the flow of molten solder will be retarded by oxide films on base metals formed by a small amount of oxygen in atmospher...

We study how to solder two Siegel chiral bosons into one scalar field in a gravitational background. Permanent address: Instituto de F́ısica, Universidade Federal do Rio de Janeiro, Brasil [email protected] [email protected]

JULY 2012 50 High-temperature solder alloys are extensively used in dieattach, power semiconductor, and optical device packaging, flip-chip packaging, etc. Current industry standard solders for these applications are mainly high-lead solders (90–97 wt-% Pb) and gold-based eutectic solder alloys such as the 80Au20Sn solder. The die-attach process involves connecting the silicon die or chips to a...

Brazed components play an essential role in consistent joining techniques. The brazing process is characterized by low process temperatures and fast processing times, compared to welding techniques. Beside the resulting low manufacturing costs, brazing can join dissimilar materials, e.g. metals and ceramics. Consequently, brazing provides potential for many industrial applications like the prod...

The unprecedented growth in the telecommunications sector in the mid to late 1990’s saw a high demand in the area of optical packages and optical networks. This sudden growth in demand for optical technology in telecom and data communication applications could not be supported by the existing manufacturing infrastructure; so, to meet the growing volume needs of the industry – the electronics ma...