A model is provided for crack problem in a functionally graded semi-infinite plate under an anti-plane load. The characteristic of material behavior is assumed to change in a linear manner along the plate length. Also the embedded crack is placed in the direction of the material change. The problem is solved using two separate techniques. Primary, by applying Laplace and Fourier transformation,...

A new method is presented for shape sensitivity analysis of a crack in a homogeneous, isotropic, and linear-elastic body subject to mode-I loading conditions. The method involves the material derivative concept of continuum mechanics, domain integral representation of the J-integral, and direct differentiation. Unlike virtual crack extension techniques, no mesh perturbation is needed in the pro...

This work deals with the interaction of P-waves between a moving central crack and a pair of outer cracks situated at the interface of an orthotropic layer and an elastic half-space. Initially, we considered a two-dimensional elastic wave equation in orthotropic medium. The Fourier transform has been applied to convert the basic problem to solve the set of four integral equations. These set of ...

Integral transform technique is employed to solve the elastodynamic problem of steadystate propagation of a Griffith crack centrally situated along the midplane of orthotropic strip of finite thickness 2h and subjected to point loading with centrally situated moving punches under constant pressure along the boundaries of the layer. The problem is reduced to the solution of a pair of simultaneou...

In this study, based on a regression of the crack tip displacements, the stress intensity range in fatigue is quantitatively determined for the shape memory alloy Ni2FeGa. The results are compared to the calculated stress intensity ranges with a micro-mechanical analysis accounting for the transformation-induced tractions. The effective stress intensity ranges obtained with both methods are in ...

0026-2714/$ see front matter 2012 Elsevier Ltd. A http://dx.doi.org/10.1016/j.microrel.2012.06.140 ⇑ Corresponding author. E-mail address: [email protected] Through-silicon vias (TSVs), being one of the key enabling technologies for three dimensional (3D) integrated circuit (IC) stacking, silicon interposer technology, and advanced wafer level packaging (WLP), has attracted tremend...

The problem of several finite moving cracks in a functionally graded material is solved by dislocation technique under the condition of anti-plane deformation. By using the Fourier transform the stress fields are obtained for a functionally graded strip containing a screw dislocation. The stress components reveal the familiar Cauchy singularity at the location of dislocation. The solution is em...

This research presents the numerical evaluation of fatigue crack growth structural steels S355 and S960 based on Paris’ law parameters (C m) that are experimentally determined with a single edge notched tension (SENT) specimen using optical gauge measurements an electromotive resonance machine at constant amplitude load. The sustainable technique is replacing destructive, time-consuming expensi...

An axi{symmetric problem for a penny{shaped crack bridged by bres is considered. The study is reduced to the analysis of a hy-persingular integral equation with respect to the relative crack{face separation over a circular domain occupied by crack. The special case of a large crack subjected to Mode{I loading is examined. A matched asymptotic expansions technique is used in order to estimate th...