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Transmission X-ray diffraction imaging in both monochromatic and white beam section mode has been used to measure quantitatively the displacement and warpage stress in encapsulated silicon devices. The displacement dependence with position on the die was found to agree well with that predicted from a simple model of warpage stress. For uQFN microcontrollers, glued only at the corners, the measu...

Reliability issues as a consequence of thermal/mechanical stresses created during packaging processes have been the main obstacle towards the realisation of high volume 3D Integrated Circuit (IC) integration technology for future microelectronics. However, there is no compelling laboratory-based metrology that can non-destructively measure or image stress/strain or warpage inside packaged chips...

Organic flip chip BGA has been quickly adopted as the mainstream package solution for high speed, high density and high power ASIC and PLD. For these applications, both die and package dimensions are generally large. It is common to see dies over 25 mm and packages of 40 mm or larger. Therefore, warpage is a big challenge. A three-dimensional finite element model was developed to predict the wa...

Investment casting is a versatile manufacturing process to produce high quality parts with high dimensional accuracy. The process begins with the manufacture of wax patterns. The dimensional accuracy of the model affects the quality of the finished part. The present study investigated the control and optimization of dimensional deviations in wax patterns. A mold for an H-shaped wax pattern was ...

Quality control is considered a critical aspect of plastic materials in the injection molding process. Two types deformations occur during process, namely, volumetric shrinkage and warpage. This study aims to optimize warpage polyethylene terephthalate preform (PET) used for packing carbonated drinks. PET results an uneven distribution material over wall surface causes variation thickness. Duri...

investment casting is a versatile manufacturing process to produce high quality parts with high dimensional accuracy. the process begins with the manufacture of wax patterns. the dimensional accuracy of the model affects the quality of the finished part. the present study investigated the control and optimization of dimensional deviations in wax patterns. a mold for an h-shaped wax pattern was ...

Abstract Electrochemical deposited (ECD) thick film copper on silicon substrate is one of the most challenging technological brick for semiconductor industry representing a relevant improvement from state art because its excellent electrical and thermal conductivity compared with traditional compound such as aluminum. The main factor that makes industrial implementation layer severe wafer warpa...