Abstract The subject of the study is deformation oxygen-free high conductivity copper. copper sample given in form a foam. undergoes an impact into elastic wall. strain rate hardening effect investigated. numerical model open-cell foam skeleton prepared framework peridynamics method. dynamic process compression with different velocities simulated. It has been found that essential for load-carry...

The question of extending limit analysis to materials with a non-associated flow rule is an old but important one. Many frictional soils, such as sands and drained clays, do not display the large volume change upon shearing that is predicted by an associated flow rule, thus calling into question the collapse loads that are found from the classical limit theorems. This question is important in p...

Thixotropic materials are complex fluids that display time-dependent viscosity and/or yield-stress response upon the application of a fixed deformation, while recovering their original structured-state when deformation is discontinued. effects presents in many different systems and applications, ranging from food products, such as ketchup, to metals, molten aluminum. In this work we present fir...

Using the periodic unfolding method we construct the homogenization theory for the quasistatic initial boundary value problems with internal variables, which model the deformation behavior of viscoplastic materials with a periodic microstructure. The free energy associated with models is assumed to be positive semi-definite only.

Xiangming Zhou, Zongjin Li, Mizi Fan, and Huapeng Chen 1 School of Engineering and Design, Brunel University, Uxbridge, Middlesex, United Kingdom UB8 3PH Tel: +44 1895 266 670, Fax: +44 1895 269 782, Email: [email protected]. 2 Department of Civil and Environmental Engineering, Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong, Tel: +852 2358 8751, Fa...

Electronic power modules devices are paramount components in the aeronautical, automotive and military applications. The solder layers are the most critical parts of the module and are usually subjected in their whole life to complex loading conditions. To improve the design task, realistic thermoelastoviscoplastic and lifetime prediction models which can describe efficiently the deformation-da...