نتایج جستجو برای: carbon nanotube bundle interconnects

تعداد نتایج: 315370  

Journal: :IPSJ Trans. System LSI Design Methodology 2008
Sudeep Pasricha Nikil D. Dutt

In deep submicron (DSM) VLSI technologies, it is becoming increasingly harder for a copper based electrical interconnect fabric to satisfy the multiple design requirements of delay, power, bandwidth, and delay uncertainty. This is because electrical interconnects are becoming increasingly susceptible to parasitic resistance and capacitance with shrinking process technology and rising clock freq...

2011
Yao Zhao Jinquan Wei Robert Vajtai Pulickel M. Ajayan Enrique V. Barrera

Creating highly electrically conducting cables from macroscopic aggregates of carbon nanotubes, to replace metallic wires, is still a dream. Here we report the fabrication of iodine-doped, double-walled nanotube cables having electrical resistivity reaching ∼10⁻⁷ Ω.m. Due to the low density, their specific conductivity (conductivity/weight) is higher than copper and aluminum and is only just be...

2006
Chen Dong Wei Wang Maher Rizkalla

The electrical properties of metallic carbon nanotubes (CNT) can rival, or even exceed, the best metals known. It is a potential candidate for future on-chip interconnect, whose performance will be dominant in the next generation integrated circuits. In this paper, a study on the modeling and simulation techniques for the CNT interconnect network is carried out. The frequency-independent models...

2004
Shigeo MARUYAMA

Single-walled carbon nanotubes (SWNTs) are expected to be the most exciting material in the nanotechnology. In addition to the outstanding electronic, optical and mechanical properties, thermal properties of SWNTs are quite unique with the high thermal conductivity along the tube axis. The molecular dynamics studies of thermal conductivity of a nanotube and thermal conductance between a nanotub...

Journal: :IEEE Transactions on Electromagnetic Compatibility 2011

2012
S. Haji Nasiri M. K. Moravvej-Farshi R. Faez

Time domain analysis of multilayer graphene nanoribbon (MLGNR) interconnects, based on transmission line modeling (TLM) using a six-order linear parametric expression, has been presented for the first time. We have studied the effects of interconnect geometry along with its contact resistance on its step response and Nyquist stability. It is shown that by increasing interconnects dimensions the...

2004
G S. Duesberg A. P. Graham M. Liebau R. Seidel E. Unger F. Kreupl W. Hoenlein

The outstanding properties of carbon nanotubes (CNTs) make them interesting for applications in microelectronics. It has been shown that they have outstanding current carrying capacity and thermal conductivity, which makes them potential candidates for interconnects on chips. Moreover, field-effect transistors based on single walled CNTs have been widely demonstrated and outperform silicon-base...

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