The authors studied the interrelation between type of structure and damage rate welded joints steam pipelines made heat-resistant pearlitic steels that were operated for a long time, i.e. more than 270 thousand hours in conditions creepage low-cycle fatigue. purpose this research was to establish structural-&-phase condition metal used elements systems their damageability service life excee...

Lateral velocity has very backbone position in the railway vehicle wheelset dynamics as it usually becomes cause of derailment by sliding due to insufficient adhesion ratio. This impropriate balance is pretext owing to contamination and weather procures the disturbances. This perturbation makes hindrances in proper running of wheelset on track. To analyze the noise, Kalman filter is used based ...

Xyloglucans are the major component of plant cell walls and bind tightly to the surface of individual cellulose microfibrils, thereby cross-linking them into a complex polysaccharide network of the cell wall. The cleavage and reconnection of xyloglucan cross-links are considered to play the leading role during chemical processes essential for wall expansion and, therefore, cell growth and diffe...

TYPES OF MELTS From the practical viewpoint, melts may be classified according to melting points which may limit the available techniques. The lowest melting, with working temperatures up to 250°, are typified by the LiNO3—NaNO3— KNO3 eutectic, NaNO3—KNO3 eutectic, LiClO4, and ammonium formate. With these solvents it is possible to use the dropping mercury electrode, or hanging mercury drop ele...

The extent of visible fungus growth on pressuresensitive electrical insulating tapes, as well as the effects of fungi on the mechanical strength of the tapes, was reported previously (Berk and Teitell, 1951). Fungi seriously decreased the tensile strength of tapes with cellulosic backings but had no more than slight effects on the tensile strength of tapes with elastomeric backings. This report...

A new package for power semiconductors has been developed: Power semiconductor chips are soldered onto a DCB ceramic substrate together with a lead frame with up to ve pins. Subsequently chips and DCB are covered by molding compound. This packaging method combines the technologies of module and discrete assembly. Thus the resulting component provides a combination of the characteristics of both...