Electromigration is one of the most important research issues affecting reliability solder joints. Current-induced Joule heating affects electromigration behavior Solder joints with different cross-sectional areas were designed to obtain properties. The effects interfacial intermetallic compound (IMC) and mechanical properties Sn58Bi/Cu studied for results showed that as area increased, joint i...

Articles you may be interested in Thermomigration and electromigration in Sn58Bi solder joints Electromigration in flip chip solder joints having a thick Cu column bump and a shallow solder interconnect Effect of entropy production on microstructure change in eutectic SnPb flip chip solder joints by thermomigration Appl. Reliability of solder joints under Electromigration (EM) and Thermomigrati...

0026-2714/$ see front matter 2012 Elsevier Ltd. A http://dx.doi.org/10.1016/j.microrel.2012.06.021 ⇑ Corresponding author at: STMicroelectronics, 8 Crolles, France. Tel.: +33 4 38 92 27 30. E-mail address: [email protected] (T. Frank). In this paper, reliability of Through Silicon via (TSV) interconnects is analyzed for two technologies. First part presents an exhaustive analysis of Cu TSV-la...

Electromigration versus line width in the 0.12–10 lm range and the configuration of the via/line contact in dual damascene Cu has been investigated. There are two scenarios for width scaling impact on electromigration. One is the width < 1 lm region, in which the MTF shows a weak width dependence, except for the via-limited condition. The other is the width > 1 lm region, in which the MTF shows...

With the increase in current densities, electromigration has become a critical concern in high-performance designs. Typically, electromigration has involved the process of time-domain simulation of drivers and interconnect to obtain average, root mean square (rms), and peak current values for each wire segment. However, this approach cannot be applied to large problem sizes where hundreds of th...

Ion-exchange membrane (IEM)-based processes are used in the industry or drinking water production to achieve selective separation. The transport mechanisms of organic solutes/micropollutants (i.e., paracetamol, clofibric acid, and atenolol) at a single-membrane level diffusion cells were similar that salts diffusion, convection, electromigration). presence an equal concentration both sides slig...

For the realization of modern integrated circuits new interconnect structures like through-silicon-vias and solder bumps, together with complex multilevel 3D interconnect structures are gaining importance. The application of these new structures unavoidably rises different reliability issues like thermal gradients, electromigration, and stressmigration. In this paper we apply state-of-the art T...