Defect analysis using a Scanning Electron Microscope (SEM), commonly known as Electron Channeling Contrast Imaging (ECCI), has received much attention in the recent past. Traditional defect analysis has for decades relied on Transmission Electron Microscopy (TEM) modalities, such as the bright field-dark field and weak beam imaging, and Scanning Transmission Electron Microcopy (STEM) diffractio...

Tribological loading of metals induces microstructural changes by dislocation-mediated plastic deformation. During continued sliding, combined shear and lattice rotation result in the formation crystallographic textures which influence friction wear at sliding interface. In order to elucidate fundamental kinematics involved this process during early stages we conducted unlubricated, linear sing...

This Letter describes the shock-induced amorphization of single-crystal Si bombarded by nanodroplets. At impact velocities of several kilometers per second, the projectiles trigger strong compression pulses lasting tens of picoseconds. The phase transition, confirmed via transmission electron microscopy and electron backscatter diffraction, takes place when the projectile's stagnation pressure ...

We present an approach for the simulation of complete electron backscatter diffraction (EBSD) patterns where the relative intensity distributions in the patterns are accurately reproduced. The Bloch wave theory is applied to describe the electron diffraction process. For the simulation of experimental patterns with a large field of view, a large number of reflecting planes has to be taken into ...

The term “electron backscatter diffraction” (EBSD) is now synonymous with both the scanning electron microscope (SEM) technique and the accessory system that can be attached to an SEM. EBSD provides quantitative microstructural information about the crystallographic nature of metals, minerals, semiconductors, and ceramics—in fact most inorganic crystalline materials. It reveals grain size, grai...