Existing theories for quantifying the morphology of nanofibers (NFs) in aligned arrays either neglect or assume a simple functional form for the curvature of the NFs, commonly known as the NF waviness. However, since such assumptions cannot adequately describe the waviness of real NFs, errors that can exceed 10% in the predicted inter-NF separation can result. Here we use a theoretical framewor...

This paper presents a novel, real-time defect detection system, based on a best-fit polynomial interpolation, that inspects the conditions of outer surfaces. The defect detection system is an enhanced feature extraction method that employs this technique to inspect the flatness, waviness, blob, and curvature faults of these surfaces. The proposed method has been performed, tested, and validate...

A process model was developed for the fabrication of closed shape composite structures such as thick-wall cylinders, with the emphasis on fiber bundle deformation and its effect on the process physics. A continuum mechanics model for fiber bundle deformation in the composite manufacturing processes was proposed. Based on this model, the winding and consolidation processes for thick wall cylindr...

The influence of in-plane fiber waviness on the first ply failure quasi-isotropic thermoplastic composite laminates was investigated. mode and stress at were studied by using a four-point bending test an end-loaded (ELB) test. experimental results confirm that no undesirable concentration due to load introduction occurred in ELB test, thereby supporting use this as alternative method measure fa...

The influence of in-plane fiber waviness defects on the compressive properties quasi-isotropic (QI) carbon polyether-ether-ketone (C/PEEK) composites was investigated experimentally. Specimens with localized were manufactured using a stamp forming process resulting into laminates featuring multiple wavy plies, i.e. from one to three 0° plies in 24-ply QI composite and range maximum angle betwee...

Silicon wafers are used as substrates to build more than 90% of integrated circuits. One of the manufacturing processes for silicon wafers is grinding. This paper reports the investigations of silicon wafer grinding using Finite Element Analysis (FEA). FEA models are first used to study the effects of process parameters on waviness reduction in the grinding of wire-sawn wafers on a rigid chuck....

A state of the art of 3D surface characterization techniques in the automotive and steel industries is presented, and links with mathematical morphology are highlighted. A surface topography decomposition method is described. It decomposes a surface into three elements: reference surface (waviness and form), superficial roughness (related to friction and wear) and valleys (related to lubricant ...

Numerical and analytical studies of the onset of percolation in high-aspect-ratio fiber fiber systems such as nanotube reinforced polymers available in the literature have consistently modeled fibers as penetrable, straight, capped cylinders, also referred to as spherocylinders. In reality, however, fibers of very high-aspect ratio embedded in a polymer do not come into direct physical contact ...