Hypersonic heating computations are still challenging due to difficulties in “A) robust capturing of shockwaves” and “B) accurate prediction of heating.” Based on our numerical survey for A), we found that the dissipation inside the numerical shock wave structure (where no physical or mathematical explanation is valid) must be proportional to Mach number, in contrast to Mach independent dissipa...

This paper presents an investigation on cooling effect and flow structure of the spherical dimple configuration during air Aluminium surface. It is prominently known that applying dimples profile causes enhancement in heat transfer over a plain A three level Box-Behnken response surface methodology was performed to find correlation between input output variables. total 17 different combinations...

Heat dissipation from electrical appliances is a significant issue with contemporary electrical devices. One factor in the improvement of heat dissipation is the heat transfer performance of the working fluid. In this study, we used plasma arc technology to produce a nanofluid of carbon nanoparticles dispersed in distilled water. In a one-step synthesis, carbon was simultaneously heated and vap...

A decoder is important component of memory, for address decoding and encoding. The size of Complementary Metal Oxide Semiconductor (CMOS) transistor keeps shrinking to increase the density on chip in accordance with Moore’s Law. The scaling affects the device performance due to constraints like heat dissipation and power consumption. A Quantum dot Cellular Automata (QCA) is an alternative to CM...

wear is a complicated phenomenon caused by the relative movement of two contacting surfaces compressed together by a normal force. prediction of the wear, in most cases, requires various experiments and microstructural characterization of the contacting surfaces. mathematical models based on physical concepts could provide considerable help in understanding the physical behavior and hence the p...

Light-emitting diode (LED) is an electronic device with high heat flux. The simulation and analysis of the heat dissipation play an important role in the improvement of performance and design of LEDmodule. In this paper, a thermal model was developed using ANSYS software to simulate the temperature distribution of LED module. The effect of thermal conductivity of MCPCB (metal-core printed circu...

Modern portable electronics have seen component heat loads increasing, while the space available for heat dissipation has decreased, both factors working against the thermal designer. This requires that the thermal management system be optimized to attain the highest performance in the given space. While adding fins to the heat sink increases surface area, it also increases the pressure drop. T...