This paper describes the design and implementation of a radiosonde which can measure the meteorological temperature, humidity, pressure, and other atmospheric data. The system is composed of a CPU, microwave module, temperature sensor, pressure sensor and humidity sensor array. In order to effectively solve the humidity sensor condensation problem due to the low temperatures in the high altitud...

Microstructure, precipitation hardening response, and mechanical and physical properties of Cu-Cr-Ag alloy and Cu-Cr-Ag-Ce alloy have been investigated using transmission electron microscopy, scanning electron microscope, optical microscope, electrical conductivity analysis, and tensile test. The influence of element Ce on the matrix refinement, impurity removal, and precipitation in the Cu-Cr-...

Both a Cu-26 wt % Ag (Fe-free) alloy and Cu-26 wt % Ag-0.1 wt % Fe (Fe-doping) alloy were subjected to different heat treatments. We studied the precipitation kinetics of Ag and Cu, microstructure evolution, magnetization, hardness, strength, and electrical resistivity of the two alloys. Fe addition was incapable of changing the precipitation kinetics of Ag and Cu; however, it decreased the siz...

A Ni2+ based colorimetric probe based on glutathione-stabilized silver/copper nanoparticles (GSH-Ag-Cu alloy NPs) in an electrospun polymer matrix is reported. Glutathione-Ag-Cu alloy NPs were characterized by ultraviolet-visible spectroscopy (UV-vis), scanning electron microscopy (SEM) and transmission electron microscopy (TEM). The freshly synthesized GSH-Ag-Cu alloy NPs in a polymer matrix w...

A humidity microsensor integrated with a readout circuit on-a-chip fabricated using the commercial 0.18 μm CMOS (complementary metal oxide semiconductor) process was presented. The integrated sensor chip consists of a humidity sensor and a readout circuit. The humidity sensor is composed of a sensitive film and interdigitated electrodes. The sensitive film is titanium dioxide prepared by the so...

The study develops an integrated humidity microsensor fabricated using the commercial 0.18 μm complementary metal oxide semiconductor (CMOS) process. The integrated humidity sensor consists of a humidity sensor and a ring oscillator circuit on-a-chip. The humidity sensor is composed of a sensitive film and branch interdigitated electrodes. The sensitive film is zinc oxide prepared by sol-gel me...

Sn–Ag–Cu composite solders reinforced with nano-sized, nonreacting, noncoarsening 1 wt% TiO2 particles were prepared by mechanically dispersing TiO2 nano-particles into Sn–Ag–Cu solder powder and the interfacial morphology of the solder and flexible BGA substrates were characterized metallographically. At their interfaces, different types of scallop-shaped intermetallic compound layers such as ...

The treatment of EPh2 (E = Te, Se) with Ag(O3SCF3) or Cu(O3SCF3)·1/2C6H6 in dichloromethane yields isomorphous complexes [Ag(TePh2)3](O3SCF3) (1), [Cu(TePh2)3](O3SCF3) (2), and [Cu(SePh2)3](O3SCF3) (3). The related reaction of TeTh2 (Th = 2-thienyl, C4H3S) with Cu(O3SCF3)·1/2C6H6 affords [Cu(TeTh2)3](O3SCF3) (4). While not isomorphic with 1-3, its crystal structure bears a close relationship wi...

This paper presents a low-cost low-power CMOS humidity sensor for passive RFID sensing applications. The humidity sensing element is implemented in standard CMOS technology without any further post-processing, which results in low fabrication costs. The interface of this humidity sensor employs a PLL-based architecture transferring sensor signal processing from the voltage domain to the frequen...