Copper layers of Printed Circuit Board (PCB) have been used as electrodes for PbS infrared structure detector to introduce low cost and simple in preparation. PbS deposition as an active layer detector has been prepared for a few micrometers in thickness using an evaporation technique under vacuum pressure at 10 Torr. Photoconductivity phenomenon has been observed from the measurement when IR r...

This Application Note presents a SPICE-based method for thermal modeling, simulation and design of a multi-channel power semiconductor switch on a Printed Circuit Board (PCB). The method allows rapid and simultaneous determination of the temperature of semiconductor junctions and the PCB track below the device, both under transient conditions and at steady-state. The model takes thermal cross-c...

With the older “through-hole” technology packages such as the Dual In-line Package (DIP), soldering to printed circuit boards was accomplished using a wave solder. The DIP leads went through holes in the printed circuit board, where they were exposed to molten solder during the mounting process. The DIP’s body was never subjected directly to the solder melt, because it was protected from the he...

This chapter describes the fundamentals of the processes used by National Semiconductor to assemble IC devices in electronic packages. Electronic packaging provides the interconnection from the IC to the printed circuit board (PCB). Another function is to provide the desired mechanical and environmental protection to ensure reliability and performance. Three fundamental assembly flow processes ...

For digital devices integrating an image-processing LSI, performance improvement, cost cutting and reduction of the time to market are essential conditions for surviving in the increasingly competitive global market. At the same time, more and more image-processing LSIs are taking the form of large-scale system-on-a-chip (SoC). It is becoming harder to design them as the degree of integration i...

In recent years there has been much pressure placed on system designers to verify their designs with computer simulations before committing to actual printed circuit board layouts and hardware. Simulating complex digital designs is extremely beneficial, and very often, the prototype phase can be eliminated entirely. The same is not true for most analog circuits. While simulation can give a grea...

The operations sheets generator (OPGEN) is an expert system that helps industrial engineers at the Hazeltine manufacturing and operations facilities plan the assembly of printed circuit boards In this article, we describe the evolution of OPGEN from its initial development in the Hazeltine research laboratories to its routine use in an integrated manufacturing environment We describe our approa...

Population-based carrier screening for single gene disorders has been occurring since the 1960s, with each decade bringing new opportunities and challenges. In February 2008, approximately 125 scientists, clinicians, public health officials, and patient representatives gathered to consider population-based carrier screening in light of lessons learned and emerging technologies. The following do...

This thesis is an exercise to investigate the various methods of creating an equivalent circuit model for a high-speed digital printed circuit board (PCB) assembly and to perform computer simulation on such a system. The term highspeed printed circuit board is widely accepted in the engineering community to be refering to PCB which is applied to digital system with operating frequency in excess...

In-circuit testers are widely used for manufacturing tests and for the measurement of printed circuit board (PCB) systems. In-circuit testers can also program and verify programmable logic devices (PLDs) that support in-system programmability (ISP). Using in-circuit testers to program ISP-capable devices allows device programming to fit into the standard manufacturing flow, reducing time-to-mar...