Thermal boundary conductance is becoming increasingly important in microelectronic device design and thermal management. Although there has been much success in predicting and modeling thermal boundary conductance at low temperatures, the current models applied at temperatures more common in device operation are not adequate due to our current limited understanding of phonon transport channels....

Thermal transport across interfaces is becoming increasingly important with the advent of nanostructures and nanocomposite materials. A nonequilibrium molecular dynamics (NEMD) approach is developed to investigate thermal transport across solid–solid interfaces. Thermal boundary conductance is calculated for a range of mismatched interfaces and compared to the diffuse mismatch model (DMM). The ...

Polyol-ester-based carbon black pastes are used to either coat or penetrate flexible graphite, thereby increasing the thermal contact conductance of flexible graphite between copper surfaces. Paste penetration by up to an effective paste thickness (the volume of the penetrated paste divided by the geometric area of the flexible graphite) of 5 lm increases the conductance by up to 350%, 98% and ...

The accuracy of predictions of phonon thermal boundary conductance using traditional models such as the diffuse mismatch model (DMM) varies depending on the types of material comprising the interface. The DMM assumes that phonons, undergoing diffuse scattering events, are elastically scattered, which drives the energy conductance across the interface. It has been shown that at relatively high t...

(2014) Surface functionalization on the thermal conductivity of graphene–polymer nanocomposites. which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited. The moral rights of the named author(s) have been asserted. Notice: Changes introduced as a result of publishing processes such as copy-editing and formatting may not be reflec...

Heat transfer of single-walled carbon nanotubes (SWNTs) in practical situations is investigated using molecular dynamics (MD) simulations. Attenuation of the expected high thermal conductivity was simulated by mixing C isotope impurities to SWNTs or binding two SWNTs with different chirality with a junction structure in between. The heat transfer through the junction can be expressed with the t...

This projects attempts to simulate accurately the thermal conductivity of honeycomb panels in the normal direction. Due to the large empty space of the honeycomb core, the thermal radiation mode of heat transfer was modeled along with conduction. Using Newton’s Method to solve for a steady state model of heat moving through the honeycomb panel, the theoretical effective thermal conduction of th...

With the ever-decreasing size of microelectronic devices, growing applications of superlattices, and development of nanotechnology, thermal resistances of interfaces are becoming increasingly central to thermal management. Although there has been much success in understanding thermal boundary conductance at low temperatures, the current models applied at temperatures more common in device opera...

A novel formal equivalence between thermal averages of coherent properties (e.g. conductance), and time averages of a single wavepacket arises for Fermi gasses and certain geometries. In the case of one open channel in a quantum point contact (QPC), only one wavepacket history, with wavepacket width equal to thermal length, completely determines thermally averaged conductance. The formal equiva...