نتایج جستجو برای: thermal cycling

تعداد نتایج: 248527  

Journal: :Genome research 2001
J Nakane D Broemeling R Donaldson A Marziali T D Willis M O'Keefe R W Davis

A large fraction of the cost of DNA sequencing and other DNA-analysis processes results from the reagent costs incurred during cycle sequencing or PCR. In particular, the high cost of the enzymes and dyes used in these processes often results in thermal cycling costs exceeding $0.50 per sample. In the case of high-throughput DNA sequencing, this is a significant and unnecessary expense. Improve...

2016
N. Rajaganesh S. Sabarinathan N. S. Azhagarasan Chitra Shankar Jaya Krishnakumar S. Swathi

BACKGROUND Chairside softliners are used more frequently than is reported and studies regarding the bond strength of chairside softliners to heat-polymerized denture base resin are few and limited. Hence, this study was conducted to comparatively evaluate the shear bond strength of two chairside soft relining materials viz., autopolymerizing plasticized acrylic resin liner and a silicone-based ...

Journal: :Microelectronics Reliability 2013
T. Frank Stéphane Moreau C. Chappaz Patrick Leduc Lucile Arnaud Aurélie Thuaire E. Chery F. Lorut L. Anghel Gilles Poupon

0026-2714/$ see front matter 2012 Elsevier Ltd. A http://dx.doi.org/10.1016/j.microrel.2012.06.021 ⇑ Corresponding author at: STMicroelectronics, 8 Crolles, France. Tel.: +33 4 38 92 27 30. E-mail address: [email protected] (T. Frank). In this paper, reliability of Through Silicon via (TSV) interconnects is analyzed for two technologies. First part presents an exhaustive analysis of Cu TSV-la...

Journal: :The journal of contemporary dental practice 2013
Mateus Rodrigues Tonetto Matheus Coelho Bandéca Hélida Gomes de Oliveira Barud Shelon Cristina Souza Pinto Darlon Martins Lima Alvaro Henrique Borges Edson Alves de Campos Marcelo Ferrarezi de Andrade

The aim of this study was to investigate whether the artificial aging by thermal cycling had influenced the marginal adaptation of class V restorations with/without chlorhexidine application in the bond process. Twelve intact human third molars were used. Class V cavity preparations were performed on the buccal surface and the teeth received 35% phosphoric acid-etching procedure (Ultradent Prod...

Journal: :Cancer research 2007
Matthew R Dreher Wenge Liu Charles R Michelich Mark W Dewhirst Ashutosh Chilkoti

The delivery of anticancer therapeutics to solid tumors remains a critical problem in the treatment of cancer. This study reports a new methodology to target a temperature-responsive macromolecular drug carrier, an elastin-like polypeptide (ELP) to solid tumors. Using a dorsal skin fold window chamber model and intravital laser scanning confocal microscopy, we show that the ELP forms micron-siz...

Journal: :Langmuir : the ACS journal of surfaces and colloids 2016
Hwi Soo Yang Sang-Hyung Kim Aravindaraj G Kannan Seon Kyung Kim Cheolho Park Dong-Won Kim

The development of silicon-based anodes with high capacity and good cycling stability for next-generation lithium-ion batteries is a very challenging task due to the large volume changes in the electrodes during repeated cycling, which results in capacity fading. In this work, we synthesized silicon alloy as an active anode material, which was composed of silicon nanoparticles embedded in Cu-Al...

2012
T. R. Sahroni S. Sulaiman I. Romli M. R. Salleh H. A. Ariff

The thermal expansion behaviour of silicon carbide (SCS-2) fibre reinforced 6061 aluminium matrix composite subjected to the influenced thermal mechanical cycling (TMC) process were investigated. The thermal stress has important effect on the longitudinal thermal expansion coefficient of the composites. The present paper used experimental data of the thermal expansion behaviour of a SiC/Al comp...

2011
Alexander Hensler

In this publication a new method of thermal impedance analysis of power modules is presented. It enables a distinction of different failure mechanisms within the heat flow path by electrical measurement during power cycling tests. With measurement and evaluation of the thermal impedance Zth the degradation can be located within chip solder layer, system solder layer and thermal interface materi...

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