In this study, we analysed the thermal performance, thermal stability and optimum design analyses of a longitudinal, rectangular fin with temperature-dependent, thermal properties and internal heat generation under multi-boiling heat transfer using Haar wavelet collocation method. The effects of the key and controlling parameters on the thermal performance of the fin are investigated. The therm...

The green hydroponics walls are among new kinds of building facades, which receive more attention from architects lately. In addition to the positive effect these walls have in maintaining humidity in arid regions, they also have positive thermal performance in both cold and hot weather conditions. Therefore, they are in the center of designers’ focus for public spaces such as schools. In terms...

In this paper, the cooling performance of water-cooled heat sinks for heat dissipation from electronic components is investigated numerically. Computational Fluid Dynamics (CFD) simulations are carried out to study the rectangular and circular cross-sectional shaped heat sinks. The sectional geometry of channels affects the flow and heat transfer characteristics of minichannel heat sinks. T...

Perovskite CH3NH3PbI3 exhibits outstanding photovoltaic performances, but the understanding of the atomic motions remains inadequate even though they take a fundamental role in transport properties. Here, we present a complete atomic dynamic picture consisting of molecular jumping rotational modes and phonons, which is established by carrying out high-resolution time-of-flight quasi-elastic and...

The 45nm Intels Coret2 family of processors, codename PenrynD, improves upon the performance of Intel Core 2 processors through new microarchitecture features, a larger cache, new instructions, and enhanced powerand thermal-management schemes. This paper presents measured performance data that show the microarchitectural benefits of the Penryn family of processors on key applications and benchm...

With the growing power consumption in modern high performance VLSI designs, nonuniform temperature distribution and limited heat-conduction capability have caused thermal induced performance and reliability degradation. Electromigration is the main reliability concern and will become a more limiting factor of IC designs. It must be addressed together with a thermal reliability modeling. This is...

A study is presented on the influence of air flow rate and surface geometry on the thermal-hydraulic performance of commercial tube-fin ‘no-frost’ evaporators. A specially constructed wind-tunnel calorimeter was used in the experiments from which data on the overall thermal conductance, pressure drop, Colburn j-factor and Darcy friction factor, f, were extracted. Eight different evaporator samp...

In this research work, numerical simulations are performed to correlate the photovoltaic parameters with various internal and external factors influencing the performance of solar cells. Single-diode modeling approach is utilized for this purpose and theoretical investigations are compared with the reported experimental evidences for organic and inorganic solar cells at various electrical and t...