To expand the range of applications multipolar bonded magnets based on a thermoplastic matrix, chemical and thermal resistance has to be increased reduced orientation in rapid solidified surface layer overcome. meet these requirements, matrix can thermosets. This paper investigates magnetic properties, especially hard fillers, pole accuracy mechanical properties ring filler strontium-ferrite-ox...

Here we assess several polymer alternatives to PDMS for rapid prototyping, especially in view of high pressure injections: Thermoset Polyester (TPE), Polyurethane Methacrylate (PUMA) and Norland Adhesive 81 (NOA81). We provide a systematic analysis of these materials with side-by-side experiments conducted in our lab, to similarly assess their magnitudes of deformation and dynamic characteristi...

The effect of the nanofiller chemistry on the mechanical behaviour of thermoset polymer matrix nanocomposites is investigated. The interaction between a crosslinked polymer resin and the reinforcing nanofibers driven by their chemistry is revealed by molecular dynamics simulations. Specifically, crosslinked network systems of neat epoxy and epoxy-P(St-co-GMA) are modeled to discuss the effect o...

Benzoguanamine (2,4-diamino-6-phenyl-1,3,5-triazine) is used to increase thermoset properties of alkyd, acrylic and formaldehyde resins. It is used as a raw material for guanamine resins. Maleic acid is used as an oil and fat preservative and food acidulant. Crystal structures of melaminium (2,4,6-triamino-1,3,5-triazin-1-ium) maleate monohydrate 201 and Bis(melaminium) DL-malate tetrahydrate 2...

This report is based on the synthesis of thermoset resins from sunflower oil. Sunflower oil with an iodine value 120 g I / 100 containing 30 % oleic acid and 59 linoleic was epoxidized by reaction a peroxy (formed in-situ between hydrogen peroxide formic acid). The ratio ethylenic unsaturation to used 1:1.5:0.5. maximum conversion generated 82.45 for seven h epoxidation at 65 °C, oxirane oxygen...

Wafer backside processing steps that include high temperature exposure may now be simplified with the use of a thermally resistant adhesive, GenTak 330. Processing at temperatures of 200oC and beyond are accepted to include plasma etching, deposition, and the curing of related polymers, such as BCB. By combining the thermoset properties of GenTak 330 with the dissolution characteristics of GenS...