Abstract At present, Sn-3.0Ag-0.5Cu (SAC305) solder is one of the commonly used lead-free solders, and copper-clad laminate PCB substrate. SAC copper substrate mainly generate two intermetallic compounds (IMCs) Cu6Sn5 Cu3Sn during soldering process. Based on first principles, this paper analyzes formation difficulty kinds IMCs generated in soldering, failure mechanism Sn/IMC IMC/Cu interfaces. ...