Nanocarbon-derived electron emission devices, specifically nanodiamond lateral field emission (FE) diodes and gated carbon nanotube (CNT) triodes, are new configurations for robust nanoelectronic devices. These novel micro/nanostructures provide an alternative and efficient means of accomplishing electronics that are impervious to temperature and radiation. For example, nitrogen-incorporated na...

Textile electronics embedded in clothing represent an exciting new frontier for modern healthcare and communication systems. Fundamental to the development of these textile is fibers forming cloths into electronic devices. An fiber must undergo diverse scrutiny its selection a multifunctional textile, viz., from material device architecture, wearability mechanical stresses, environmental compat...

Solution-based deposition techniques are widely considered to be a route to low-cost, high-throughput photovoltaic device fabrication. In this report, we establish a methodology for a highly scalable deposition process and report the synthesis of an air-stable, vulcanized ink from commercially available precursors. Using our air-stable ink rolling (AIR) process, we can make solar cells with an ...

This paper is aimed at creating a vacuum and a gas handling subsystem. The new vacuum and the gas handling subsystem was developed at IPP/Prague after the COMPASS tokamak reinstallation. It was necessary to build a system which can operate 24/7 and be fully autonomous. A firmware programmed in the C programming language controls devices connected to the vacuum and the gas handling subsystem. Th...

The use of single molecules as active components in electronic devices is presently considered a potential alternative to semiconductor-based nanoscale electronics since it directly provides precisely-defined nano-scale components for electronic devices which eventually allows for simple processing and device fabrication. In the present thesis the self-assembly and electron transport properties...

Fuji Electric has developed processes to fabricate ICs. The process satisfies demands for a display driver IC of up to about 100V for a liquid crystal display (LCD), plasma display panel (PDP) and vacuum fluorescent display (VFD). The power control IC has up to about 40V of high voltage and high current analog signal control. The ICs are fabricated using the CMOS (complementary MOS) oxide isola...