نتایج جستجو برای: wafer pollutants
تعداد نتایج: 51061 فیلتر نتایج به سال:
The NIST Noise Project has developed the theoretical formalism and experimental methods for performing accurate noise-temperature measurements on a wafer. This report summarizes the theoretical formulation and describes the design, methods, and results of tests performed to verify our ability to measure on-wafer noise temperature. Several different configurations with known off-wafer noise sour...
This chapter provides an overview of a hybrid metal/polymer wafer bonding plat-form using damascene-patterned intermediate layers for wafer bonding and elec-trical interconnections. This hybrid bonding platform combines the advantagesof metal-to-metal bonding (for direct electrical interstrata interconnection) andpolymer bonding (for robust thermomechanical wafer bonding strengt...
In this study, a new technique of selective microcap bonding for packaging 3-D MEMS (Micro Electro Mechanical Systems) devices is presented. Microcap bonding on a selected area of the host wafer was successfully demonstrated through flip chip and wafer level alignment. A passivation treatment was developed to separate the microcap from the carrier wafer. A thick metal nickel (Ni) microcap was f...
In a modern Technology CAD (TCAD) simulation environment data exchange between different simulators often remains as unsolved challenge. One natural way of data interchange is lo use a file format common to all tools involved in the process flow. This approach, however, lacks the func-tionality often required between certain steps. First, there is the need to ensure a consistent input-wafer for...
This paper presents a new wafer-level micromold processing technology of Pyrex7740 glass for micro-fluidic devices, which is based on viscous deformation at temperatures above glass softening point temperature, and it is also described as a thermoforming process. The fabrication of microchannels on Pyrex7740glass wafer with high aspect ratio has come true. It could also retain the original surf...
This work presents a high yield wafer scale fabrication of MEMS-based unimorph silicon/PZT thick film vibrational energy harvesters aimed towards vibration sources with peak frequencies in the range of a few hundred Hz. By combining KOH etching with mechanical front side protection, SOI wafer to accurately define the thickness of the silicon part of the harvester and a silicon compatible PZT th...
We introduce the concept of wafer bowing to affect nanoimprinting. This approach allows a design that can fit the key imprinting mechanism into a compact module, which we have constructed and demonstrated with an overlay and resolution of <0.5 microm and <10 nm, respectively. In the short term, this wafer bowing approach makes nanoimprint lithography much more accessible to a broad range of res...
Because of the pressure of globalization in the last two decades, professional services has become an important strategic decision so that supplier selection is a prime concern. In the semiconductor industry, the prior researches worked on analyzing and improving the process, and evaluating the equipment manufacturers. Consequently, this study is to identify critical factors related to the wafe...
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