The present study evaluates the process activation energy or thermal diffusion (TDAE) to understand aging kinetics transformation kinetics. AA7075–5 Vol.% of SiCp composite were fabricated through stir casting technique. Differential scanning calorimetry (DSC) was carried out at different heating rates precipitation sequence and evaluate composite. Rockwell hardness tests investigated behavior ...

With the advent of large number of composite materials, a systematic study of machining characteristics of these new materials is necessary for their rapid adoption in the actual engineering applications. This paper is an attempt to understand the machining characteristics of Al/SiCp composite material, which is the most widely used and projected to have large application in the near future. A ...

In this paper, an experiment is conducted to optimize the kerf width of wire electrical discharge machining (WEDM) on Aluminum hybrid composite with Zinc coated brass wire using Taguchi method. Aluminum metal matrix composites (MMCs) reinforced with silicon carbide particulate (SiCp) find several applications due to their improved mechanical properties for a wide variety of aerospace and automo...

Experimental analysis of conventional turning (CT) and ultrasonically assisted (UAT) two varieties particulate SiC infused aluminium metal matrix composite (217XG, 225XE) is carried out. The results indicate the amount tangential cutting force reduction in UAT compared to CT increased at lower speed higher depth-of-cut. using carbide tools reduced average forces by 60.5%, 29.5% for 217XG 225XE,...

In this investigation, experiments were carried out to understand the influence of various grinding parameters like wheel speed, workspeed and depth of cut on the grinding temperature at the surface of the Al-SiCP composite workpiece with different grinding wheels. The temperature distribution within the workpiece was studied by simulating the grinding process and using finite element analysis ...

In this work, a novel processing method called powder thixoforming was proposed to prepare composites reinforced with 50 vol % of SiC particles (SiCp) that were used for electronic packaging in order to investigate the effects of remelting duration on its microstructure and properties. Optical Microscope (OM), Scanning Electron Microscope (SEM), X-ray Diffraction (XRD) and Transmission Electron...