In this study, the effect of input parameters of Electro Discharge Machining (EDM) process including polarity, peak current, pulse on time, duty cycle, gap voltage and concentration of abrasives powder in dielectric fluid on surface roughness are experimentally investigated. A L18 Taguchi’s standard orthogonal array is used for experimental design. Copper is used as tool electrode to machine H1...

Major occupational exposures to silica occur in the mining, stone-cutting, and abrasives industries [1,2]. Estimates of the total number of exposed workers in the US today range from 1.2 to 3 million people [2]. Although prolonged exposure to silica has long been associated with pulmonary pathology, a growing body of evidence suggests that the lung is not the only organ affected by silicosis. S...

Hardest 10. Diamond he selection of abrasive media for blast cleaning steel is based primarily on two broad objectives, quality and economics. Quality is defined in terms of appearance after cleaning (SSPC-SP 7, 6, 10, and 5 ) , profile depth and contour, and chemical cleanliness. The economics of an abrasive is determined by its initial cost and by the production rate that can be achieved when...

As an environmentally friendly method, water jet (WJ) technology plays a significant role in the field of remanufacturing cleaning. The cleaning capacity WJ is severely restricted by pressure, while impact force will be too large and may damage cleaned substrate as well cause energy waste if pressure high. However, adding abrasives, low-pressure (LPWJ) considerably improved. Although abrasive (...

It may be true that some commercially available blast cleaning abrasives will reveal the presence of soluble chlorides or sulfate salts. Such abrasive contamination may originate from various sources. One potential source could be the raw material process water containing chloride or sulfate salts in solution. Contamination may also occur during the transportation of the abrasive along the seac...

Introduction The Chemical Mechanical Planarization (CMP) process plays a key role in the manufacture of data storage, video display panels, and semiconductor chips. The process combines the chemical (acidic or basic) effect of the slurry, which contains micro-abrasives with the mechanical effect provided by polishing to reduce the topography on the wafer or rigid disk substrate. The process for...