This paper proposes to study the performance of carbon nanotube bundle in terms of delay as a VLSI interconnect at 32nm technology node. Output waveform and 90% propagation delay are analytically determined and compared with SPICE simulation result. Alpha power law model is used for representing the transistors of CMOS driver. SPICE simulation result reveals that delay increases with increase i...

This paper compares the performance in terms of delay and power of Multi Walled Carbon Nanotubes (MWCNT)based interconnects at 22nm technology node. Similar analysis is carried out for copper based interconnect and results are compared with MWCNT at different interconnect lengths. This analysis shows that due to low resistance and inductance MWCNT bundle interconnect is of lower delay and power...

Article history: Received 28 October 2013 Received in revised form 5 December 2013 Accepted 26 December 2013 Available online 24 January 2014 In this work, we propose two carbon nanotube (CNT) network fabrication processes, the normal spin rate coating (NR) and the slow spin rate coating (SR), and two interconnect structures, the single layer structure (SL) and the double layer structure (DL), ...

The effect of sonication temperature on the debundling of carbon nanotube (CNT) macro-bundles is reported and demonstrated by analysis with different particle sizing methods. The change of bundle size over time and after several comparatively gentle sonication cycles of suspensions at various temperatures is reported. A novel technique is presented that produces a more homogeneous nanotube disp...

Transport measurements on a bundle of single-walled carbon nanotubes have been made below 4.2 K as a function of side gate and source–drain bias voltage. The transport of an individual nanotube is described by the Coulomb blockade effect. The zero-dimensional quantum states of the nanotube become clear for measurements of large bias voltage. In addition, we present preliminary results of microw...

The work in this paper addresses the need to evaluate the impact of emerging interconnect technologies, such as carbon nanotubes (CNTs), in the context of system applications. The critical properties of CNTs are described in terms of equivalent material parameters such that a general methodology of interconnect sizing can be used. This methodology is used to rescale the interlayer dielectric (I...