© Springer International Publishing Switzerland 2015 K.-T. Chau and J. Zhao (eds.), Bifurcation and Degradation of Geomaterials in the New Millennium, Springer Series in Geomechanics and Geoengineering, DOI 10.1007/978-3-319-13506-9_38 Abstract Micromechanical change in packing structures can provide significant insights to better understand the cyclic mobility and post-liquefaction behaviors o...

By employing the in situ transmission electron microscopy (TEM) technique, tensile deformation behaviors of a silver nanowire (NW) with a single twin structure were studied. Our observations revealed that the initial stage of plastic deformation was dominated by surface-mediated partial dislocation activities. Strikingly, the void formation and growth were shown to govern the later stage of pla...

Recent discovery that nanoscale twin boundaries can be introduced in ultrafine-grained metals to improve strength and ductility has renewed interest in the mechanical behavior and deformation mechanisms of these nanostructured materials. By controlling twin boundary spacing, the effect of twin boundaries on void growth is investigated by using atomistic simulation method. The strength is signif...

a structured mathematical model of anaerobic conversion of complex organic materials in non-ideally cyclic-batch reactors for biogas production has been developed. the  model is based on multiple-reaction stoichiometry (enzymatic hydrolysis, acidogenesis, acetogenesis and methanogenesis), microbial growth kinetics, conventional material balances in the liquid and gas phases for a cyclic-batch r...

The onset and growth of a dust void are investigated in a radio-frequency (rf) sheath of a capacitively coupled argon plasma. A circularly symmetric void emerges and grows with increasing rf power and pressure in the central region of the dust cloud levitating in the sheath. Experimental measurements of the void diameter are compared with the predictions of a simple phenomenological theory, bas...

Analytical detection of cracking in connections of steel moment resisting frames using simple damage indices is important since these cracks are not visible unless the connections are uncovered. In this paper, applicability of three cumulative damage indices for detection of cracking in a cover plate welded moment connection is investigated. The damage indices considered in this study are based...

To understand a void formation mechanism in electroplated Cu interconnects used for Si-ULSI (ultra-large scale integrated) devices, microstructures of Cu films which were prepared by the electroplating technique using plating baths with or without organic additives were investigated by transmission electron microscopy (TEM). In the as-deposited samples, a high density of micro-voids were observ...