Due to the thin InAlN barrier layer, leakage current is a serious problem in InAlN/GaN high-electron-mobility transistors (HEMTs). The InGaN back-barrier can raise conduction band of GaN buffer layer and enhance carrier confinement, resulting reduced current. surface oxidation treatment prior gate deposition form an oxide reduce In this study, using both technologies, record low off (Ioff) high...

Narrow-channel accumulated body nMOSFET devices with p-type side gates surrounding the active area have been electrically characterized between 100 and 400 K varied side-gate biasing ( ${V}_{\text {side}}$ ). The subthreshold slope (S...

Received April 27, 2012 Revised May 14, 2012 Accepted May 26, 2012 Application of symmetric double gate vertical metal oxide semiconductor field effect transistors (MOSFETs) is hindered by the parasitic overlap capacitance associated with their layout, which is considerably larger than for a lateral MOSFET on the same technology node. A simple process simulation has been developed to reduce the...

We present a modeling scheme for simulating ballistic hole transport in thin-body fully depleted silicon-on-insulator pMOSFETs. The scheme includes all of the quantum effects associated with hole confinement and also accounts for valence band nonparabolicity approximately. This simulator is used to examine the effects of hole quantization on device performance by simulating a thin (1.5-nm) and ...

As the continuous down scaling of MOSFET device is required to increase the speed and packaging density of it, but it reduces the device characteristics in terms of short channel effect and reverse leakage current. At present, the single gate MOSFET reaching its scaling limit. These limitations associated with scaling give birth to number of innovative techniques which includes the use of diffe...

This paper is investigated the low frequency noise behavior in subthreshold regime of gate-all-around silicon nanowire field effect transistors. Downscaling of multi gate structure beyond 50 nm gate length describes the quantum confinement related model. A drain current model has been described for output characteristics of silicon nanowire FET that is incorporated with velocity saturation effe...

A hetero gate dielectric low band gap material DG Tunnel FET is presented here. The investigated device is almost free from short channel effects like DIBL and t V rolloff. Simulation of the device characteristics shows significant improvement over conventional double gate TFET when compared interms of on current, ambipolar current, roll-off, miller capacitance and, device delay time. Simulatio...

Abstract: We present the optimization of the manufacturing process of the 5nm bulk-FinFET technology by using the 3D process and device simulations. In this paper, bysimulating the manufacturing processes, we focus on optimizing the manufacturingprocess to improve the drive current of the 5nm FinFET. The improvement of drivecurrent is one of the most important issues in ...