By MEMS packaging test platform for bonding process of bonding temperature and bonding time, and test silicon specifications experimental study. Experimental results indicate that when the bonding voltage of 1200V, bonding temperature of 445 0 C to 455 0 C, bonding time is 60s, the void fraction is less than 5%. Glass and silicon wafer bonding quality can achieve the best. The experimental resu...

Effects of some important parameters like impactor effects, plug geometry and initiation points on bonding aluminum tubes to aluminum plugs were studied. The impact velocity and dynamic angle between tube and plug should be precisely managed to achieve an optimum bonding condition. A new explosive bonding technique with the use of two material impactors was proposed. Results are especially suit...

Background and Aim: Recurrent caries and low bond strength are the main causes of composite restorations failure. This study sought to assess the effect of chlorhexidine (CHX) on micro-shear bond strength (MSBS) to dentin of a fourth generation adhesive system and a universal bonding agent after aging. Materials and Methods: This in vitro study used 32 extracted third molars and 3-5mm thick de...

objective: the objective of this study was to compare the tensile bond strength of metal brackets bonding to glazed ceramic surfaces using three various surface treatments. materials and methods: forty two glazed ceramic disks were assigned to three groups. in the first and second groups the specimens were etched with 9.5% hydrofluoric acid (hfa). subsequently in first group, ceramic primer and...

to evaluate the interfacial morphology and the bond strength produced by the three-step, two-step and single-step bonding systems in primary teeth.occlusal surfaces of 72 extracted human deciduous teeth were ground to expose the dentin. the teeth were divided into four groups: (a) scotchbond multipurpose (3m, espe), (b) adh se (vivadent), (d) optibond all-in-one (kerr) and (e)futurabond nr (voc...