intellectual capital (ic) is organizational intangible asset which is frequently associated with performance. ic is commonly categorized into three core components: human capital, structural capital and relational capital. this study takes a step further in the evolution of the ic model for the hotel industry and divides relationship capital into two categories: end customer- relationship capit...

The protective effects of a subunit vaccine, recombinant protein Edwardsiella tarda glyceraldehyde 3-phosphate dehydrogenase (Rec) combined with peptidoglycan (PGN) and polyinosinic:polycytidylic acid (polyIC), against edwardsiellosis in Japanese flounder Paralichthys olivaceus were investigated to evaluate an adjuvant property pathogen-associated molecular patterns. ?By injection the mixture p...

Today’s business and mission-critical servers require a high level of reliability and availability, which must be built into software and hardware from the beginning. This keynote will describe how Sun leverages its processors and ASICs to improve test and reliability from IC to system, and what we need from our partners in the ATE and EDA communities to meet the challenge of providing a highly...

The IC industry is built on a foundation of simulation and prediction. We use models for frequency, power, yield, cost... We rarely prototype, or crash test! Models are derived from “characterization” which is done at multiple nested levels. Manufacturing, Devices, Gates, Units, Chips. Technology complexity beyond the 90nm node is making this characterization and representation increasingly dif...

Overcoming the IC power challenge requires signal energy recovery, which can be achieved utilizing adiabatic charging principles and logically reversible computing in the circuit design. This paper demonstrates the energyefficiency of a Bennett-clocked adiabatic CMOS multiplier via a simulation model. The design is analyzed on the logic gate level to determine an estimate for the number of irre...

The first solution for addressing this new wire bonding challenge was the matte finish. Along with some geometrical capillary tip modifications, such as the double internal chamfer (IC), these changes proved Cu wire to be a reliable substitute to gold (Au). However, while the welding requirements were achieved, the tool’s resistance to wear deteriorated. This was expected as the hardness of Cu ...