An integrated circuit design facility has been established at APL to help tap the vast potential of very large scale integrated circuits for space applications. A custom N-channel metal-oxide semiconductor chip containing 7000 transistors has been successfully fabricated by a silicon foundry using the design database produced by the APL facility. This project is a tangible step toward creating ...

This paper will review the typical gate drive requirements for the latest generation of high power IGBT modules and present simplified implementations of the required circuits using newly developed hybrid integrated circuit (HIC) building blocks. A newly developed circuit that provides short circuit protection without desaturation detection will also be presented.

Amid the blizzard of design-automation technologies, the analytical MOSFET models (and their associated model parameter sets) receive scant attention from the design community. However, these models and parameter sets are fundamental to the design process, since they represent the critical "communication link" between a design group and its wafer foundry. In particular, analog integrated circui...

The complexity of Application Specific Integrated Circuits (ASICs) is continuously increasing. Consequently chip-design becomes more and more challenging. To handle this complexity for a fast ASIC development, the existing design process has to become more efficient. To achieve this, we used an approach based on a multi-agent simulation. A mutli-agent system is an intuitive way to represent a t...

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Hardware Trojans are an increasingly significant threat to the integrated circuit (IC) industry in both commercial and military fields due to the progress of globalization and the rapidly improving IC manufacturing technology in various countries. Because of global economic pressures, the development and fabrication of advanced ICs are often outsourced offshore in order to reduce cost. As a res...

The P1149.4 mixed-signal boundary scan standard is demonstrated with a CMOS integrated circuit. Design issues and characterization data are presented.

The lithography process is the critical step in the fabrication of nanostructures for integrated circuit manufacturing. It accounts for one third of the costs of manufacturing integrated circuits. The rapid transition to smaller microelectronic feature sizes involves the introduction of new lithography technologies, new photoresist materials, and tighter processes specifications. This transitio...

Many auditory theorists consider the temporal adaptation of the auditory nerve a key aspect of speech coding in the auditory periphery. Experiments with models of auditory localization and pitch perception also suggest temporal adaptation is an important element of practical auditory processing. I have designed, fabricated, and successfully tested an analog integrated circuit that models many a...