In current VLSI circuits, interconnect delay dominates gate delay. As a result, high-level synthesis and physical layout tools are taking interconnect delay into account. Interconnects are generally in the form of a tree rather than a single line. Thus, accurate simulation and efficient calculation of propagation delay for interconnect trees are critical to performance driven synthesis and layo...

This paper highlights key emerging issues in the domain of interconnect modeling and analysis. The implications of various nanoscale effects on VLSI interconnect performance, reliability, power dissipation and parasitic extraction are also presented. Finally, promising new technologies are outlined which have the potential to meet these interconnect challenges in the nanometer era.

We present a comprehensive physical model for the whole life cycles of electromigration induced voids. Special emphasis is put on explaining the void morphology and its impact on interconnect resistance. Investigations for common twoand three-dimensional interconnect structures are presented. Implications of the theoretical analysis and the simulation results for modern interconnect design are ...

Title of Document: DETECTION OF INTERCONNECT FAILURE PRECURSORS USING RF IMPEDANCE ANALYSIS Daeil Kwon, Doctor of Philosophy (Ph.D.), 2010 Directed By: Chair Professor and Director, Michael Pecht, Department of Mechanical Engineering Many failures in electronics result from the loss of electrical continuity of common board-level interconnects such as solder joints. Measurement methods based on ...

Optical interconnect is claimed to have signi ̄cant advantages over electrical interconnect due to the superior physical properties of photon propagation over electron propagation. These advantages translate to the well-known fundamentally di®erent bandwidth/distance/cross-section relationships of optical interconnects as compared to their electrical counterparts. Despite the validity of these b...

A vertical-cavity surface-emitting laser based bidirectional free-space optical interconnect has been implemented to interconnect two printed circuit boards. A total of 512 clustered channels with a density of 2844 channels/cm2 are transmitted over a distance of 83 mm. The optical interconnect is a combination of refractive microlenses and diffractive minilens relays.