A physically rigorous computational algorithm is developed and applied to calculate subcontinuum thermal transport in structures containing semiconductor-gas interfaces. The solution is based on a finite volume discretization of the Boltzmann equation for gas molecules in the gas phase and phonons in the semiconductor . A partial equilibrium is assumed between gas molecules and phonons at the i...

asymmetrically mixed matrix matrimid-mil-53 membranes with silicone cover layer were fabricated. for better understanding of membrane fabrication process, three main parameters of fabrication, matrimid concentration, silicone concentration and weight percentage of metal organic framework (mil-53) particles, were optimized by an experimental design method. cross-section sem images were used to s...

Heat transfer through the gas diffusion layer (GDL) is a key process in the design and operation of a PEM fuel cell. The analysis of this process requires determination of the effective thermal conductivity. This transport property differs significantly in the through-plane and in-plane directions due to the anisotropic micro-structure of the GDL. In the present study, a novel test bed that all...

 In this research, a numerical modeling was utilized to calculate the stresses caused during thermal cycling in a functionally graded thermal barrier coating (FG - TBC). The temperature – dependent material response of this protective material was taken into account and the effects of thermal cycle and interface morphology of the ceramic / metallic layer in functionally graded coating system wa...

A novel system is developed for measuring the thermal resistance across thin layers of sintered copper wicks of varying porosity. Wicks to be tested are integrated into a passive vertical thermosyphon system and the resistance is measured for a series of input power levels. The wicks are sintered to a thermally conducting pedestal above a pool of de-ionized water and heated from below. The appa...

A thermal interface material (TIM) is a crucial material for transferring heat from a die to a heatsink. We developed a new TIM composed of carbon nanotubes, silicon thermal grease, and chloroform. The thermal impedance of the TIM was measured using a new device based on thermometer principles to measure thermal impedance and resistance. This device consists of an alumina substrate, titanium tu...

Thermal contact constriction between a chip and a heat sink assembly of a microelectronic application is investigated in order to access the thermal performance. The finite element model (FEM) of the electronic device developed using ANSYS software was analysed while the micro-contact and micro-gap thermal resistances were numerically analysed by the use of MATLAB. In addition, the effects of f...

A compact analytical model is proposed for predicting thermal joint resistance of rough polymer-metal interfaces in a vacuum. The model assumes plastic deformation at microcontacts and joint temperatures less than the polymer’s glassy temperature. The joint resistance includes two components: (i) bulk resistance of the polymer, and (ii) microcontacts resistance, i.e., constriction/spreading res...