Very thin liquid jets can be obtained using electric field, whereas an electrically-driven bending instability occurs that enormously increases the jet path and effectively leads to its thinning by very large ratios, enabling the production of nanometre size fibres. This mechanism, although it was discovered almost one century ago, is not yet fully understood. In the following study, experiment...

Beyond printing text on paper, inkjet printing methods have recently been applied to print passive electrical and optical microparts, such as conductors, resistors, solder bumps and polymeric micro lenses. They are also useful to print micro-electro-mechanical systems (MEMS) as sub-millimeter sensor and actuator arrays, such as multifunctional skins applicable to robotic application and ambient...

In the process of form control using bonnet polishing an influence function is of vital importance for establishing material removal rates. However, the effects of polishing cloth, workpiece hardness and polishing parameters (such as precess angle, head speed, tool pressure and tool offset) on influence function when polishing CoCr alloys are not yet established and these factors affect the det...

Recently, the magnetorheological (MR) polishing process has been examined asa new ultra-precision polishing technology for micro parts in MEMS applications. In theMR polishing process, the magnetic force plays a dominant role. This method uses MRfluids which contains micro abrasives as a polishing media. The objective of the presentresearch is to shed light onto the material removal mechanism u...

Through a systematic experimental investigation into the polishing of polycrystalline diamond composites by the dynamic friction technique, this paper identified three major regimes of polishing conditions: the regime capable of a low material removal, that enabling a safe, high removal processing, and that of an unsafe but ultra-high material removal. The study concluded that a higher polishin...

The mechanism of copper (Cu) voids formation from electro-chemical plating (ECP) followed by Cu chemical mechanical polishing (CMP) are studied in Cu dual-damascene interconnection. The formation of Cu voids at metal lines is the main problem that causes not only the failure of via-induced metal-island corrosion but also yield loss. The galvanic theory and Cu lifting mechanism are proposed to e...