The mechanisms of seeding and nucleation of Cu nanoclusters onto an ultrathin alumina template supported on Ni3Al(111) has been investigated by means of ab initio calculations. Single Cu ad-atom diffusion on the oxide film is effective at room temperature, allowing preferential occupation of the defective sites of the so-called "dot" structure, where the adsorption is much stronger than in the ...

The application of intermetallic compounds for understanding in heterogeneous catalysis developed in an excellent way during the last decade. This review provides an overview of concepts and developments revealing the potential of intermetallic compounds in fundamental as well as applied catalysis research. Intermetallic compounds may be considered as platform materials to address current and f...

Intermetallic precipitates are widely used to tailor mechanical properties of structural alloys but are often destabilized during plastic deformation. Using atomistic simulations, we elucidate structural instability mechanisms of intermetallic precipitates associated with dislocation motion in a model system of Al2Cu. Interaction of non-coplanar <001> dislocation dipoles during plastic deformat...

The quest for solid-state materials with tailored chemical and physical features stimulates the search for general prescriptions to recognize and forecast their electronic structures providing valuable information about the experimentally determined bulk properties at the atomic scale. Although the concepts first introduced by Zintl and Hume–Rothery help to understand and forecast the bonding m...

in this research, tribological behavior of ti-ni-p intermetallic coatings on titanium substrates have been investigated under dry reciprocating conditions. hardness profile testing results exhibit that high surface hardness has been attained and static indentation result shows that the intermetallic coating has better adhesion strength than the conventional ceramic coatings. in this respect, th...

There are several issues related to the mechanical and electrical wirebond failure during wirebonding process. Major factors are associated with AuAl intermetallic system. AuAl intermetallic compounds (IMC) can easily form at room temperature and can be accelerated with the elevated temperature. In this paper, pattern of intermetallic compounds growth and potential degradation due to voids in t...

Increasing environmental concerns and pending government regulations have pressured microelectronic manufacturers to find suitable alternatives to Pb-bearing solders traditionally used in electronics packaging. Over recent years, Sn-rich solders have received significant attention as suitable replacements for Pbbearing solders. Understanding the behavior of intermetallics in Sn-rich solders is ...