نتایج جستجو برای: pulse reverse electrodeposition
تعداد نتایج: 202972 فیلتر نتایج به سال:
Cu–Al2O3 composite coatings were prepared in the use of pulse jet electrodeposition technology. Pulse current parameters including duty cycle and frequency researched about their effects on microstructure variation Al2O3 nanoparticles content coating. The mechanical properties anti-corrosion resistance coating examined. results show that properly decreasing raising are able to generate a compac...
The microstructure of copper layers obtained by electrodeposition in stationary, pulsed and stochastic modes on substrates was studied means scanning electron microscopy. It found that the shape applied grains differs significantly case stationary application modes. technology production electrodeposited pulse is worked out work. developed automated software hardware complex used to control pro...
The Fe nanowires were prepared by Ac electrodeposition method. The two steps anodized aluminum oxides (alumina) were used as templates for electrodeposition of magnetic nanowires. Sulfuric acid was used to anodize aluminum. The pours diameter and growth rate of alumina were investigated. The FeSO4 electrolyte was used for growth of nanowires. The prepared magnetic nanowires were characterized b...
cofecu nanowires were deposited by pulsed electrodeposition technique into the porous alumina templates by a two-step mild anodization technique, using the single-bath method. the electrodeposition was performed in a constant electrolyte while cu constant was controlled by electrodeposition current. the electrodeposition current was 3.5, 4.25, 5 and 6 ma. the effect of electrodeposition current...
In this paper, the influence of initial momentum and the injection angle of electron in to the magnetized plasma in a laser wake-field accelerator have been studied.It has been seen that the use of external magnetic field in the opposite direction of laser pulse propagation leads to an increase in the wake-field amplitude and a decrease in laser pulse group velocity in comparison to the use of ...
This study has examined the pulse electrodeposition of copper from a deep eutectic solvent. Pulse plating parameters were selected using methodologies originally developed for aqueous solutions, including constraints arising double layer charging and mass transport effects. Although could be deposited under nearly all conditions, in many instances only partial was observed current efficiencies ...
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