نتایج جستجو برای: reinforced parameter

تعداد نتایج: 258059  

2013
BENJAMIN SCHARF

A rather tricky question is the construction of wavelet bases on domains for suitable function spaces (Sobolev, Besov, Triebel-Lizorkin type). In his monograph from 2008, Triebel presented an approach how to construct wavelet (Riesz) bases in function spaces of Besov and Triebel-Lizorkin type on cellular domains, in particular on the cube. However, he had to exclude essential exceptional values...

2008
M. Dawood S. H. Rizkalla

This paper describes a research program that was conducted in two phases to study the behavior of a high modulus CFRP system for strengthening steel structures. The first phase of the research consisted of an experimental program and finite element analysis to study the bond characteristics of the system. The findings indicate that a reverse tapered plate end detail can effectively increase the...

2015
Pablo Zuluaga-Ramírez Malte Frövel Tomás Belenguer Félix Salazar

This work presents an optical non-contact technique to evaluate the fatigue damage state of CFRP structures measuring the irregularity factor of the surface. This factor includes information about surface topology and can be measured easily on field, by techniques such as optical perfilometers. The surface irregularity factor has been correlated with stiffness degradation, which is a well-accep...

2017
V. Keim

The importance of fibre reinforced plastics continually increases due to the excellent mechanical properties, low material and manufacturing costs combined with significant weight reduction. Today, components are usually designed and calculated numerically by using finite element methods (FEM) to avoid expensive laboratory tests. These programs are based on material models including material sp...

Development of electronic industries, compression of electronic equipment, and removing lead from electronic circuits for environmental issues, resulted in a significant challenge in design and development of tin-based lead-free solders with physical and mechanical properties similar to old tin-lead alloys. In this regard, the set of Sn-Ag-Cu alloys with eutectic and near eutectic compositions ...

Development of electronic industries, compression of electronic equipment, and removing lead from electronic circuits for environmental issues, resulted in a significant challenge in design and development of tin-based lead-free solders with physical and mechanical properties similar to old tin-lead alloys. In this regard, the set of Sn-Ag-Cu alloys with eutectic and near eutectic compositions ...

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