The unprecedented growth in the telecommunications sector in the mid to late 1990’s saw a high demand in the area of optical packages and optical networks. This sudden growth in demand for optical technology in telecom and data communication applications could not be supported by the existing manufacturing infrastructure; so, to meet the growing volume needs of the industry – the electronics ma...

Title of Document: CHARACTERIZATION OF FR-4 PRINTED CIRCUIT BOARD LAMINATES BEFORE AND AFTER EXPOSURE TO LEAD-FREE SOLDERING CONDITIONS Ravikumar Sanapala, Master of Science, 2008 Directed By: Chair Professor, Michael G. Pecht, Department of Mechanical Engineering The transition to lead-free soldering of printed circuit boards (PCBs) using solder alloys such as Sn/Ag/Cu has resulted in higher t...

In this paper, I develop the Soldering formalism in a new domain the noncommutative planar gauge field theories. The Soldering mechanism fuses two distinct theories showing opposite or complimentary properties of some symmetry, taking into account the interference effects. The above mentioned symmetry is hidden in the composite (or soldered) theory. In the present work it is shown that a pair o...

OBJECTIVES 22 workers, exposed to potassium aluminium tetrafluoride used as flux for soldering aluminium, were studied as clinical outpatients for symptoms of irritation of the nose, eye, skin, and airways. METHODS 16 volunteered for spirometry with methacholine provocation test including a test for small airways function by volume of trapped gas (VTG). RESULTS Median (range) latency time b...