نتایج جستجو برای: thermal bonding

تعداد نتایج: 258729  

Journal: :Bulletin of the Japan Institute of Metals 1986

Journal: :ECS Journal of Solid State Science and Technology 2015

Journal: :Nuclear Instruments and Methods in Physics Research 2021

For manufacturing Micromegas detectors, the “bulk” method based on photoetching, was successfully developed and widely used in nuclear particle physics experiments. However, complexity of requires a considerable number advanced instruments processing, limiting accessibility this for production detectors. In view these limitations with bulk method, new thermal bonding technique (TBM) has been to...

Journal: :Microelectronics Reliability 2011
Y. H. Tian C. J. Hang C. Q. Wang G. Q. Ouyang D. S. Yang J. P. Zhao

The small outline transistor (SOT) devices which were interconnected with 20 lm copper bonding wire and encapsulated with commercial epoxy molding compound (EMC) have been used in a series of reliability tests which including the thermal shock test, the electrical service life test, and the isothermal aging test. Isolated IMC spots were found at the bonding interface during the thermal shock te...

2017
Abbas Azari Sakineh Nikzad Jamnani Arash Yazdani Faezeh Atri Vania Rasaie Abbas Fazel Anvari Yazdi

Objectives Many advantages have been attributed to dental zirconia ceramics in terms of mechanical and physical properties; however, the bonding ability of this material to dental structure and/or veneering ceramics has always been a matter of concern. On the other hand, hydroxyapatite (HA) shows excellent biocompatibility and good bonding ability to tooth structure, with mechanically unstable ...

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