New European product standards now include a mandatory requirement for manufacturers to declare the temperature-dependent thermal conductivity for each insulation used in building equipments and industrial installations. For pipe insulation systems, the measurement is usually performed by a standard pipe test method, in which the value on a large temperature range is integrated to reduce temper...

This paper reports on the dissipation of heat generated by a high power LED array using piezoelectric fans. Both numerical and experimental studies were carried out to evaluate the heat dissipation efficiency of high power LED package operating under multiple vibrating fans. Two vibrating fans were vertically oriented to the LED package and arranged according to configuration A (for edge to edg...

heat and mass transfer, in this paper, is considered in one-row heat exchanger, that fins are hotter than air flow and water is added to fins. related governing equations are derived by analyzing a two-dimension model in a unique cell of a heat exchange. these equations are numerically solved by finite difference method. heat transfer and efficiency under partially wet surface are calculated by...

A simple method for transistor DC parameter extraction is presented, where the self-heating of the transistor is taken into account. The thermal behaviour of the transistor is modelled using a single thermal resistance, whose value is extracted simultaneously with the electrical parameters. When pulsed measurements are performed the usage of the thermal resistance, as an effective thermal resis...

INTRODUCTION Phonon scattering at the interface between two materials results in a thermal resistance, R [1]. An ability to accurately predict the thermal resistance of semiconductor interfaces is important in devices where phonon interface scattering is a significant contributor to the overall thermal resistance (e.g., computer chips with high component density). This ability will also lead to...

the fluid flow and heat transfer in a three-dimensional microchannel filled with al2o3- water nanofluid is numerically investigated. the hybrid scheme is used to discretize the convection terms and simpler algorithm is adopted to couple the velocity and pressure field in the momentum equations. the thermal and flow fields were analyzed using different volume fractions of nanoparticles and diffe...

Carbon nanotubes and graphene are promising materials for thermal management applications due to their high thermal conductivities. However, their thermal properties are anisotropic, and the radial or cross-plane direction thermal conductivity is low. A 3D Carbon nanotube (CNT)-graphene structure has previously been proposed to address this limitation, and direct molecular dynamics simulations ...

In this research, fire and radiant heat protection and thermal comfort properties of cotton/nylon-Kermel blended woven fabrics, were utilized to predict the thermal comfort and protection limit of this fabric structure based on Woo and Barker developed model. The results showed that the porosity, the air permeability and the thermal resistance increased with Kermel fiber blend ratio. Conversely...

Thermal adhesives that contain large concentrations of high thermal conductivity filler materials, such as ceramics or metals, are widely used by the electronics industries in a variety of applications. The thermal properties of these materials, such as the thermal contact resistance across a bonded joint and the thermal conductivity of the bulk material, are critical to the selection of the “b...

In this paper an extensive verification of the extraction method (published earlier) that consistently accounts for self-heating and Early effect to accurately extract both base and thermal resistance of bipolar junction transistors is presented. The method verification is demonstrated on advanced RF SiGe HBTs were the extracted results for the thermal resistance are compared with those from an...