Thanks to recent advances in CNNs, solid improvements have been made in semantic segmentation of high resolution remote sensing imagery. However, most of the previous works have not fully taken into account the specific difficulties that exist in remote sensing tasks. One of such difficulties is that objects are small and crowded in remote sensing imagery. To tackle with this challenging task w...

In this paper, we present a new design of a sweptvolume 3D-360-degree display system with rotating LED panel. This system, which adopts the idea of modular design, is constituted of a mechanical part, a circuit part and a software part. The circuit part is mainly composed of synchronous control module, high speed data transmission module, display module and display control module, etc. The mech...

We de ne a complex R=J of graded modules on a d-dimensional simplicial complex , so that the top homology module of this complex consists of piecewise polynomial functions (splines) of smoothness r on the cone of . In a series of papers ([4], [5], [6]), Billera and Rose used a similar approach to study the dimension of the spaces of splines on , but with a complex substantially di erent fromR=J...

Let $R$ be a commutative ring with identity. The purpose of this paper is to introduce and study two classes of modules over $R$, called $mbox{Max}$-injective and $mbox{Max}$-strongly top modules and explore some of their basic properties. Our concern is to extend some properties of $X$-injective and strongly top modules to these classes of modules and obtain some related results.

The collector ring (CR) of the FAIR project will include a fast stochastic cooling system for rare isotope beams ( β = 0.83) and antiprotons ( β = 0.97). To reach a good signal to noise ratio of the pick-up even with a low number of particles, a cryogenic movable pick-up electrode system based on slotlines is under development. The sensitivity and noise properties of an electrode array has been...

Copper sinter paste has been recently established as a robust die-attach material for high -power electronic packaging. This paper proposes and studies the implementation of copper materials to create top-side interconnects, which can substitute wire bonds in power packages. Here, was exploited fully printed interconnect and, additionally, clip-attach. The electrical thermal performances copper...

we state several conditions under which comultiplication and weak comultiplication modulesare cyclic and study strong comultiplication modules and comultiplication rings. in particular,we will show that every faithful weak comultiplication module having a maximal submoduleover a reduced ring with a finite indecomposable decomposition is cyclic. also we show that if m is an strong comultiplicati...

The current paper describes an aspect for development of Baseband and LMP layers defined in Bluetooth 1.1 standard specification for implementation purposes. The structure of developed unit consist: control module which manages all other modules in the system, an interface module for interaction with L2Cap and LMP layers, separated modules for data reception and transmition, a module for interf...

in this paper, we show that every element of a discrete module is a sum of two units if and only if its endomorphism ring has no factor ring isomorphic to $z_{2}$. we also characterize unit sum number equal to two for the endomorphism ring of quasi-discrete modules with finite exchange property.